S34ML04G200BHI003

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S34ML04G200BHI003

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IC FLASH 4GBIT PARALLEL 63BGA

  • FabricanteCypress Semiconductor Corp

  • Peça do Fabricante #S34ML04G200BHI003

  • Pacote VFBGA-63

  • Em Estoque2945

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Especificações

Atributo Valor
Supplier Flip Electronics
Package / Case Tape & Reel (TR)
Series ML-2
Part Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 4Gb (512M x 8)
Memory Interface Parallel
Write Cycle Time - Word Page 25ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

Visão Geral

Description

S34ML04G200BHI003 is a 4‑gigabit serial NOR flash memory from Spansion/Cypress. It stores firmware and code for embedded systems and is accessed over a high‑speed serial interface (SPI, with QPI/QSPI modes commonly supported). Typical features include page program, sector/block erase, fast read, low‑power modes, and security/memory-protection options. The suffix BHI003 denotes the package/revision variant. It’s used for boot code, firmware updates, and persistent data in microcontrollers and other embedded devices. For exact electrical specs (voltage range, maximum clock rate, endurance) and package details, consult the official S34ML04G200BHI003 datasheet.

Equivalent

Equivalent devices (4Gbit SPI-NOR) commonly used as drop-ins: Macronix MX25L4006E, Winbond W25Q40BV, Gigadevice GD25Q40B, ISSI IS25LP040D. Verify voltage, speed (MHz), timing, memory organization, and package to match S34ML04G200BHI003.

Pinout

- Pin count: 8 pins
- Function: Serial NOR flash memory (SPI/Quad SPI capable) used for non-volatile code/data storage; pins include Vcc, GND, CS, CLK, MOSI, MISO, WP, and HOLD.

Manufacturer

- Manufacturer: Spansion (now Cypress Semiconductor; part of Infineon Technologies).
- Company type: A semiconductor company that designs and manufactures flash memory products, especially NOR flash for embedded systems.

Application

Note: S34ML04G200BHI003 is a 4Gbit NAND flash memory device used for data storage in various devices.
Typical application areas:
- Embedded storage in mobile devices, wearables, and consumer electronics
- Removable storage: USB drives, SD/memory cards
- Solid-state drives (SSDs) and embedded SSDs in laptops/desktops/servers
- Automotive: infotainment, navigation, telematics, instrument clusters
- Industrial/IoT: data loggers, controllers, edge devices, smart meters
- Digital cameras, set-top boxes, game consoles

Package

BGA package (FBGA)

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