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S34ML08G101TFI000
+Lista de MateriaisIC FLASH 8GBIT PARALLEL 48TSOP I
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FabricanteCypress Semiconductor Corp
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Peça do Fabricante #S34ML08G101TFI000
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Pacote TFSOP-48
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Em Estoque5533
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Especificações
| Atributo | Valor |
| Package / Case | Tray,Tray |
| Series | ML-1 |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 8Gb (1G x 8) |
| Memory Interface | Parallel |
| Write Cycle Time - Word Page | 25ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Visão Geral
Description
Key features of the S34ML08G101TFI000 include:
- Density: 8 Gb of storage capacity.
- Architecture: Single-Level Cell, allowing for faster read and write operations compared to multi-level cell technologies.
- Interface: It utilizes an asynchronous interface, compatible with standard NAND interface protocols.
- Package: Typically available in a TSOP (Thin Small Outline Package) or similar compact packaging.
- Performance: It provides high-speed data transfer and is optimized for endurance and reliability with wear-leveling and error correction capabilities.
- Temperature Range: It supports industrial temperature ranges, making it suitable for a wide range of operating environments.
This NAND Flash chip is appropriate for applications requiring efficient data storage with a balance of performance and reliability.
Equivalent
1. Micron - MT29F8G08ABABA
2. Samsung - K9F8G08U0F
3. Toshiba - TH58NVG5S0HBAI4
4. SK Hynix - H27U8G8G5CTR-BC
These chips typically offer similar NAND Flash memory features, such as SLC technology, parallel interface, and comparable capacities. Always check specific datasheets for detailed compatibility.
Features
The device supports a data transfer rate up to 25 nanoseconds and includes a built-in Error Correcting Code (ECC) to enhance data integrity. It offers a parallel interface, enabling high-speed data access. The operating temperature range is from -40°C to 85°C, suitable for industrial use.
Package type for the S34ML08G101TFI000 is typically a 48-pin TSOP (Thin Small Outline Package), which is a common form factor for NAND flash, allowing for compact integration into circuit boards. The chip is designed to be used as a reliable storage solution in demanding environments.
Pinout
This NAND Flash memory device is organized as 8-bit, and its primary function is to store data non-volatilely. The S34ML08G101TFI000 features an 8Gb (gigabit) density and is used in applications requiring reliable data storage, such as in consumer electronics, industrial systems, and other embedded systems.
Key functions of the pins include:
- Data I/O (DQ0-DQ7): Bidirectional data lines for reading and writing data.
- CLE (Command Latch Enable): Used to latch command inputs.
- ALE (Address Latch Enable): Used to latch address inputs.
- CE# (Chip Enable): Activates the chip when low.
- RE# (Read Enable): Controls data output during read operations.
- WE# (Write Enable): Controls data input during write operations.
- WP# (Write Protect): Protects against accidental data programming or erasure.
- R/B# (Ready/Busy): Indicates the status of the device.
- VCC: Power supply input.
- VSS: Ground.
Overall, the S34ML08G101TFI000 is designed for efficient data storage and retrieval in various electronic devices.
Manufacturer
Application
1. Consumer Electronics: Used in devices like digital cameras, smartphones, and tablets for data storage.
2. Industrial Systems: Employed in embedded systems and industrial control units for data logging and firmware storage.
3. Automotive: Utilized in infotainment systems and advanced driver-assistance systems (ADAS).
4. Networking Equipment: Integral in routers and switches for configuration data storage.
5. Medical Devices: Supports data storage in diagnostic equipment.
6. Computers and Peripherals: Used in solid-state drives (SSDs) and external storage devices.
These applications leverage the chip’s non-volatile storage capabilities, durability, and efficiency.