Imagens apenas para referência
SC18IS602BIPW/S8
+Lista de MateriaisNXP Semiconductors SC18IS602BIPW/TSSOP16//S8/REEL 13 Q2/T3 *STANDARD
-
FabricanteSemiconductores NXP
-
Peça do Fabricante #SC18IS602BIPW/S8
-
Em Estoque27582
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
Visão Geral
Description
The SC18IS602BIPW/S8 is a bridge integrated circuit designed by NXP Semiconductors. It serves as an I2C-bus to SPI bridge, facilitating communication between I2C-bus master devices and SPI slave devices. This chip enables devices that communicate via I2C to interface with SPI peripherals, expanding the versatility of microcontroller applications.
The SC18IS602BIPW/S8 operates with a supply voltage range from 2.4V to 3.6V and supports I2C bus speeds up to 400 kHz. It features programmable clock speeds for SPI communication and offers four programmable slave select outputs, making it suitable for systems requiring expansion of SPI peripherals.
The device supports a wide temperature range, making it adaptable for various applications, including consumer electronics, industrial automation, and embedded systems. It has a compact TSSOP-16 package that facilitates integration into space-constrained designs.
Overall, the SC18IS602BIPW/S8 provides a reliable and efficient solution for bridging I2C and SPI protocols, enhancing the connectivity and functionality of modern electronic systems.
The SC18IS602BIPW/S8 operates with a supply voltage range from 2.4V to 3.6V and supports I2C bus speeds up to 400 kHz. It features programmable clock speeds for SPI communication and offers four programmable slave select outputs, making it suitable for systems requiring expansion of SPI peripherals.
The device supports a wide temperature range, making it adaptable for various applications, including consumer electronics, industrial automation, and embedded systems. It has a compact TSSOP-16 package that facilitates integration into space-constrained designs.
Overall, the SC18IS602BIPW/S8 provides a reliable and efficient solution for bridging I2C and SPI protocols, enhancing the connectivity and functionality of modern electronic systems.
Equivalent
The SC18IS602BIPW/S8 is an I2C-bus to SPI bridge from NXP. Equivalent products from other manufacturers include:
1. Maxim Integrated: MAX7319, a similar I2C to SPI bridge.
2. Texas Instruments: TCA8418, an I2C to SPI interface option.
3. Microchip Technology: MCP2210, another USB to SPI bridge but often used in similar applications.
Note that specification differences may exist, so review datasheets to ensure compatibility with your application.
1. Maxim Integrated: MAX7319, a similar I2C to SPI bridge.
2. Texas Instruments: TCA8418, an I2C to SPI interface option.
3. Microchip Technology: MCP2210, another USB to SPI bridge but often used in similar applications.
Note that specification differences may exist, so review datasheets to ensure compatibility with your application.
Features
The SC18IS602BIPW/S8 is a bridge IC designed by NXP Semiconductors, primarily used to interface between I²C-bus and SPI bus devices. Here are its key features:
1. I²C to SPI Bridge: Converts I²C commands into SPI, enabling communication between I²C masters and SPI slaves.
2. I²C Interface: Supports standard (up to 100 kHz) and fast (up to 400 kHz) I²C-bus speeds.
3. SPI Interface: Operates as a master with programmable clock frequencies up to 1.8 Mbps.
4. GPIOs: Offers up to 8 configurable I/O pins for additional control or status functions.
5. Wide Voltage Range: Operates from 2.4 V to 3.6 V, making it suitable for battery-powered applications.
6. Low Power Consumption: Energy-efficient design for use in power-sensitive applications.
7. Compact Package: Available in a small, space-saving TSSOP16 package.
8. Interrupt Capabilities: Features an interrupt output pin to signal the I²C master of events.
9. EEPROM Support: Capable of interfacing with EEPROMs over SPI.
These features make the SC18IS602BIPW/S8 ideal for applications where I²C and SPI device integration is required.
1. I²C to SPI Bridge: Converts I²C commands into SPI, enabling communication between I²C masters and SPI slaves.
2. I²C Interface: Supports standard (up to 100 kHz) and fast (up to 400 kHz) I²C-bus speeds.
3. SPI Interface: Operates as a master with programmable clock frequencies up to 1.8 Mbps.
4. GPIOs: Offers up to 8 configurable I/O pins for additional control or status functions.
5. Wide Voltage Range: Operates from 2.4 V to 3.6 V, making it suitable for battery-powered applications.
6. Low Power Consumption: Energy-efficient design for use in power-sensitive applications.
7. Compact Package: Available in a small, space-saving TSSOP16 package.
8. Interrupt Capabilities: Features an interrupt output pin to signal the I²C master of events.
9. EEPROM Support: Capable of interfacing with EEPROMs over SPI.
These features make the SC18IS602BIPW/S8 ideal for applications where I²C and SPI device integration is required.
Pinout
The SC18IS602BIPW/S8 is an I2C-bus to SPI bridge from NXP Semiconductors. It comes in a TSSOP-16 package and has 16 pins. Here’s a brief overview of its pin functions:
1. VDD (Pin 1): Supply voltage.
2. GND (Pin 8): Ground.
3. SDA (Pin 2): I2C-bus data line.
4. SCL (Pin 3): I2C-bus clock line.
5. RESET (Pin 4): Resets the device.
6. SS (Pin 9): Slave Select line for SPI.
7. MOSI (Pin 11): Master Out, Slave In for SPI.
8. MISO (Pin 12): Master In, Slave Out for SPI.
9. SCK (Pin 13): Serial Clock for SPI.
10. IO0 to IO5 (Pins 5, 6, 7, 10, 14, 15): General-purpose I/O pins, configurable for various functions.
11. WP (Pin 16): Write Protect for SPI EEPROMs.
The SC18IS602BIPW/S8 facilitates communication between an I2C-bus controlled device and an SPI-controlled device, supporting applications where I2C and SPI buses need to interface seamlessly.
1. VDD (Pin 1): Supply voltage.
2. GND (Pin 8): Ground.
3. SDA (Pin 2): I2C-bus data line.
4. SCL (Pin 3): I2C-bus clock line.
5. RESET (Pin 4): Resets the device.
6. SS (Pin 9): Slave Select line for SPI.
7. MOSI (Pin 11): Master Out, Slave In for SPI.
8. MISO (Pin 12): Master In, Slave Out for SPI.
9. SCK (Pin 13): Serial Clock for SPI.
10. IO0 to IO5 (Pins 5, 6, 7, 10, 14, 15): General-purpose I/O pins, configurable for various functions.
11. WP (Pin 16): Write Protect for SPI EEPROMs.
The SC18IS602BIPW/S8 facilitates communication between an I2C-bus controlled device and an SPI-controlled device, supporting applications where I2C and SPI buses need to interface seamlessly.
Manufacturer
The SC18IS602BIPW/S8 is manufactured by NXP Semiconductors. NXP Semiconductors is a global semiconductor company based in the Netherlands. It specializes in providing solutions for secure connections for embedded applications. The company develops a wide range of semiconductor products, including microcontrollers, processors, sensors, RF components, and secure connectivity solutions, which are used in various industries such as automotive, industrial, consumer electronics, and communication infrastructure. NXP is known for its innovation in secure identification, automotive, and digital networking sectors.
Application
The SC18IS602BIPW/S8 is an I2C-bus to SPI bridge. Its primary application areas include interfacing microcontrollers with SPI devices using the I2C protocol, enabling communication between I2C-based systems and SPI peripherals. It's commonly used in scenarios where a system needs to expand its communication capabilities to include SPI devices, such as in sensor networks, embedded systems, industrial automation, and consumer electronics. This bridge can also be utilized in situations where reducing the number of microcontroller I/O pins is necessary, or when integrating existing I2C infrastructure with newer SPI components in a system upgrade.
Package
The SC18IS602BIPW/S8 is packaged in a TSSOP-16 (Thin Shrink Small Outline Package with 16 pins) format.
