SE97BTP

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  • FabricanteSemiconductores NXP

  • Peça do Fabricante #SE97BTP

  • Ficha Técnica SE97BTP DataSheet

  • Em Estoque21458

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Especificações

Atributo Valor
EURoHS Compliant
ECCN(US) EAR99
PartStatus Unconfirmed
HTS 8542.39.00.60
Automotive No
PPAP No
Mounting Surface Mount
MinimumOperatingTemperature(°C) -55
MaximumOperatingTemperature(°C) 125
PackageHeight 0.73
PackageWidth 3
PackageLength 2
PCBchanged 8
StandardPackageName SON
SupplierPackage HWSON EP
PinCount 8
LeadShape No Lead
Module/ICClassification IC
Resolution(bit) 11
Accuracy ±2°C
InterfaceType Serial (2-Wire, I2C, SMBus)
OutputType Digital
MinimumOperatingSupplyVoltage(V) 3
TypicalOperatingSupplyVoltage(V) 3.3
MaximumOperatingSupplyVoltage(V) 3.6
MaximumSupplyCurrent(uA) 400

Visão Geral

Description

"Introduction to SE97BTP" likely refers to a course or module with the code SE97BTP. While there is no universally recognized course with this exact code, the format suggests it could be part of a specialized academic program, possibly in engineering, technology, or a related field. The "Introduction to" component implies that it is an entry-level course designed to provide foundational knowledge and skills relevant to the broader subject area.
In such a course, students might expect to learn basic concepts, theories, and methodologies pertinent to the discipline. The course may include lectures, hands-on activities, and assessments to ensure students grasp the essential aspects before moving on to more advanced topics. It serves as a stepping stone, preparing students for subsequent, more specialized modules.
For a precise understanding of SE97BTP, including its objectives, content, and prerequisites, it would be best to consult the specific institution's course catalog or contact their academic department directly.

Equivalent

The SE97BTP is a temperature sensor with integrated EEPROM produced by NXP Semiconductors. Equivalent products would include similar temperature sensors with EEPROM features from other manufacturers. Some possible alternatives are:
1. Maxim Integrated DS1621 - Digital thermometer and thermostat with EEPROM.
2. Microchip Technology AT30TS750A - Temperature sensor with non-volatile memory.
3. Texas Instruments TMP112 - High-accuracy digital temperature sensor with non-volatile memory.
These alternatives provide comparable functionality, though specifications may vary. Always check detailed datasheets to ensure compatibility.

Features

The SE97BTP is a temperature sensor commonly used in various applications. Key features include:
1. Temperature Sensing: Accurate temperature measurement capability, often with a range suitable for many industrial and consumer applications.
2. Digital Interface: Typically equipped with an I2C interface, allowing for easy integration with microcontrollers for data communication.
3. High Precision: Offers high precision and reliability in temperature readings, which is crucial for sensitive applications.
4. Low Power Consumption: Designed to consume minimal power, making it suitable for battery-operated devices.
5. Small Form Factor: Compact size allows for easy incorporation into space-constrained designs.
6. Wide Operating Voltage: Can operate over a range of voltages, enhancing its versatility across different systems.
7. Built-in Features: May include features such as programmable temperature limits and alarms for system protection and monitoring.
8. Robust Design: Resistant to environmental factors, ensuring stable performance in various conditions.
These features make the SE97BTP a versatile choice for temperature monitoring in electronics, industrial systems, and more.

Pinout

The SE97BTP is a temperature sensor with an integrated EEPROM designed for monitoring and reporting temperatures in electronic devices. It typically comes in a small package with an 8-pin configuration. The pin functions are generally as follows:
1. VDD: Power supply pin.
2. GND: Ground reference pin.
3. SDA: Serial Data Line, used for I2C communication.
4. SCL: Serial Clock Line, used for I2C communication.
5. A0, A1, A2: Address pins used to set the I2C address, allowing multiple devices on the same bus.
6. EVENT: Interrupt or alert output pin, which can signal an over-temperature condition or other configurable events.
These pins facilitate communication and function within an I2C interface, allowing the device to read temperature data and store or retrieve information from its EEPROM. Always refer to the manufacturer’s datasheet for precise specifications and functionalities.

Manufacturer

The SE97BTP is manufactured by NXP Semiconductors. NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands. It specializes in the design and production of a wide range of semiconductor solutions, including microcontrollers, communication chips, and integrated circuits for automotive, industrial, mobile, and consumer applications. The company is known for its innovations in secure connectivity solutions and is a leading player in markets such as automotive electronics, secure identification, and Internet of Things (IoT) technologies.

Application

SE97BTP is a specialized material known for its high-performance properties, primarily used in electronic and semiconductor industries. Key application areas include:
1. Semiconductor Fabrication: Utilized in processes such as photolithography due to its chemical stability and resistance.
2. Display Technologies: Employed in manufacturing OLED and LCD displays for its excellent optical clarity.
3. Advanced Coatings: Used for protective and anti-reflective coatings on electronic components.
4. Microelectronics: Integral in the production of printed circuit boards (PCBs) due to its insulating properties.
5. Optoelectronics: Applied in the development of optical fibers and sensors.
These applications leverage SE97BTP's durability, chemical resistance, and electrical insulation capabilities.

Package

The SE97BTP is typically offered in a TSSOP (Thin Shrink Small Outline Package) package type. TSSOP is a surface-mount package with a smaller footprint and lower profile than traditional SOIC packages, making it suitable for compact electronic devices.

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