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SIC471ED-T1-GE3
+Lista de MateriaisIC REG BCK ADJ POWERPAK MLP55-27
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FabricanteVishay Siliconix
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Peça do Fabricante #SIC471ED-T1-GE3
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Especificações
| Atributo | Valor |
| Series | microBUCK® |
| Part Status | Active |
| Base Product Number | SIC471 |
| Function | Step-Down |
| Output Configuration | Positive |
| Topology | Buck |
| Output Type | Adjustable |
| Number of Outputs | 1 |
| Voltage - Input (Min) | 4.5V |
| Voltage - Input (Max) | 55V |
| Voltage - Output (Min/Fixed) | 0.8V |
| Voltage - Output (Max) | 50.6V |
| Current - Output | 12A |
| Frequency - Switching | 20kHz ~ 2MHz |
| Synchronous Rectifier | Yes |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
| Package | PowerPAK® MLP55-27 |
| Supplier Device Package | PowerPAK® MLP55-27 |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
Visão Geral
Description
1. Course Code Breakdown:
- SIC: Could denote the department or field, such as Science, Information Technology, or a specialized program name.
- 471: Typically indicates an advanced level course, possibly designed for upper-year undergraduates or graduate students.
- ED: Might signify a focus on education or a specific educational technology.
- T1: Could represent the term or semester (Term 1).
- GE3: Possibly refers to a general education requirement or a specific course version/sequence.
2. Content and Objectives:
- This course may cover specialized topics within its broader field, aiming to provide advanced knowledge or skills.
- Objectives might include critical thinking, practical applications, and preparation for professional practice or further study.
For precise details, consult the course syllabus or the department offering the course.
Equivalent
Features
1. N-Channel Enhancement Mode: This MOSFET operates as an n-channel device, meaning it conducts when a positive voltage is applied to the gate relative to the source.
2. Low On-Resistance: It offers low R_DS(on), which results in higher efficiency and lower power loss during operation, making it suitable for power-sensitive applications.
3. High-Speed Switching: The device supports rapid switching speeds, enhancing performance in high-frequency applications.
4. Thermal Efficiency: Designed to handle significant power loads efficiently, the package supports effective heat dissipation.
5. Robust Design: Typically includes features like ESD protection and a rugged body diode, which contribute to reliability and durability.
6. Package Type: It often comes in a compact, surface-mount package, such as a PowerPAK or similar, facilitating easy integration into circuit boards.
These attributes make it suitable for applications in power management, DC-DC converters, and motor control systems.