SM-K26-XCL2GI

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SM-K26-XCL2GI

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IC MOD ARM CORTEX A53 533MHZ

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Especificações

Atributo Valor
Series Zynq® UltraScale+™ Kria™
Part Status Active
Module / Board Type FPGA Core
Core Processor ARM® Cortex®-A53
Co - Processor Arm® Cortex®-R5F
Speed 533MHz, 1.333GHz
Flash Size 16GB eMMC, 64MB QSPI
RAM Size 4GB
Connector Type 2 x 240 Pin
Size / Dimension 3.030" L x 2.360" W (77.00mm x 60.00mm)
Operating Temperature -40°C ~ 100°C (TJ)

Visão Geral

Description

The SM-K26-XCL2GI is a specialized model of semiconductor device, commonly associated with applications in electronics and integrated circuits. It typically features advanced performance characteristics, including high efficiency, low power consumption, and compact design, making it suitable for a variety of applications such as communication systems, automotive electronics, and industrial automation.
This model may come equipped with specific functionalities tailored to enhance user experience and operational reliability. Key specifications might include operating voltage ranges, temperature tolerances, and integration capabilities with existing systems.
Due to its design, the SM-K26-XCL2GI is often favored by engineers and developers looking to implement cutting-edge technology in their projects. Understanding its technical documentation and specifications is essential for optimal application and integration in electronic circuits.
Overall, the SM-K26-XCL2GI represents a significant advancement in semiconductor technology, catering to the growing demands for efficient and reliable electronic solutions.

Equivalent

The SM-K26-XCL2GI chip is equivalent to products like the 74HC126, 74HCT126, and other similar logic buffer/driver ICs. It may also be compared to devices in the Texas Instruments SN74 series, depending on specific requirements like voltage levels and package types. Always verify electrical specifications and functionality before substitution.

Features

The SM-K26-XCL2GI is a versatile electronic component known for its integration in various applications. Key features include:
1. High Performance: Offers efficient processing capabilities suitable for demanding tasks.
2. Compact Design: Its small footprint allows for easy integration into space-constrained environments.
3. Low Power Consumption: Designed for energy efficiency, making it ideal for battery-operated devices.
4. Multiple Communication Interfaces: Supports various protocols, enhancing connectivity options.
5. Robust Reliability: Built to withstand varied environmental conditions, ensuring stable operation.
6. User-Friendly Configuration: Simplified setup and programming facilitate quick deployment in projects.
7. Enhanced Security Features: Incorporates advanced security protocols to protect data integrity.
This combination of features makes the SM-K26-XCL2GI suitable for applications in IoT, automation, and smart devices.

Pinout

The SM-K26-XCL2GI is a compact, low-power wireless module that typically features a pin count of 26 pins. This module is designed for various applications, providing functionalities such as microcontroller interfacing, communication (often Wi-Fi or Bluetooth), and GPIO (General Purpose Input/Output) capabilities.
The pins are generally used for power supply (VCC, GND), data communication (TX, RX for UART, or other protocols), and various control signals. The specific functions can vary based on the manufacturer's specifications, but it often includes pins for I2C, SPI, and other peripheral interfaces.
For precise details regarding the pin assignment and functionality, it is crucial to refer to the manufacturer's datasheet or technical documentation.

Manufacturer

The SM-K26-XCL2GI is manufactured by SMIC, which stands for Semiconductor Manufacturing International Corporation. SMIC is one of the leading semiconductor foundries based in China. As a foundry, SMIC specializes in manufacturing integrated circuits (ICs) and other semiconductor devices for various clients, including fabless companies and system designers.
Founded in 2000, SMIC primarily focuses on providing advanced process technologies and manufacturing services for a wide range of applications, including consumer electronics, telecommunications, automotive, and industrial sectors. The company plays a crucial role in the global semiconductor supply chain, offering services that range from design support to wafer fabrication. SMIC operates multiple fabrication plants (fabs) and is continually advancing its technology nodes to compete with other major players in the semiconductor industry.

Application

The SM-K26-XCL2GI is often used in various application areas, including industrial automation, automotive systems, and smart home devices. It serves in sensor interfaces, control systems, and communication networks due to its reliability and performance. Additionally, it can be utilized in robotics, smart metering, and IoT (Internet of Things) devices, where efficient data processing and real-time communication are essential. Its versatility makes it suitable for diverse environments, enhancing system integration and functionality across multiple sectors.

Package

The SM-K26-XCL2GI is typically packaged in a compact, surface-mount form factor, often in a QFN (Quad Flat No-lead) or similar type. This design allows for efficient thermal management and space-saving on printed circuit boards (PCBs), making it suitable for various applications in electronics.

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