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SMP100LC-160
+Lista de MateriaisTHYRISTOR 160V 400A DO214AA
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FabricanteSTMicroeletrônica
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Peça do Fabricante #SMP100LC-160
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Ficha Técnica SMP100LC-160 DataSheet
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Pacote DO-214AA
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Especificações
| Atributo | Valor |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | SMP, TRISIL™ |
| ProductStatus | Active |
| Voltage-Breakover | 200V |
| Voltage-OffState | 160V |
| Current-PeakPulse(8/20µs) | 400 A |
| Current-PeakPulse(10/1000µs) | 100 A |
| Current-Hold(Ih) | 150 mA |
| NumberofElements | 1 |
| Capacitance | 65pF |
| MountingType | Surface Mount |
Visão Geral
Description
### Key Features:
- Low VF: Minimizes power loss.
- High current capability (160A).
- Fast switching: Reduces reverse recovery time.
- Surface-mount (SMP) package: Compact and suitable for automated assembly.
- High thermal performance: Efficient heat dissipation.
### Applications:
- Switching power supplies.
- DC-DC converters.
- Reverse polarity protection.
- Freewheeling diodes.
Ideal for high-frequency and high-efficiency designs where space and thermal management are critical.
Equivalent
- STPS160U (STMicroelectronics)
- SB160 (Vishay/General Semiconductor)
- SS160 (Fairchild/ON Semiconductor)
- MBR160 (ON Semiconductor)
These alternatives offer similar specifications (16A, 60V Schottky diodes) and can serve as replacements depending on availability and application requirements. Always verify datasheet compatibility.
Features
- Low Capacitance: Typically 0.5pF per line, minimizing signal distortion.
- ESD Protection: Meets IEC 61000-4-2 (Level 4: ±30kV contact/air discharge).
- High Surge Handling: Supports IEC 61000-4-5 (40A, 8/20µs).
- Low Clamping Voltage: Ensures robust protection for sensitive circuits.
- Compact Package: SOT-23-6L for space-constrained designs.
- Multi-Channel Protection: 4-line protection in a single package.
- Fast Response Time: <1ns to clamp transient voltages.
Ideal for USB, HDMI, Ethernet, and other high-speed data lines.
Pinout
Pin Count:
- 4 pins (typically includes Gate, Drain, Flange/Base, and sometimes an additional ground or thermal pad).
Key Functions:
1. Gate (Input): Controls the transistor's conduction.
2. Drain (Output): Delivers amplified RF power.
3. Flange/Base: Serves as both ground and heat sink attachment.
4. Thermal Pad (if present): Enhances heat dissipation.
Specs:
- Frequency: Up to 160 MHz.
- Power: 100W (typical).
- Package: Industry-standard (e.g., TO-270AA or similar).
Designed for robustness in RF amplification, it requires proper heat management.
Application
- Power Supplies: Efficient rectification in AC/DC converters.
- Solar Energy Systems: Optimizing power conversion in inverters.
- Automotive Electronics: Enhancing performance in alternators and battery chargers.
- Industrial Equipment: Reliable operation in motor drives and welding machines.
- Telecom Infrastructure: Ensuring stable power in base stations and servers.
Its low forward voltage drop and high surge capability make it ideal for high-frequency, high-efficiency applications.
