SY6874DBC

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  • FabricanteSilergy Corp

  • Peça do Fabricante #SY6874DBC

  • Ficha Técnica SY6874DBC DataSheet

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Especificações

Atributo Valor
Manufacturer Silergy Corp
Package DFN-10-EP(3x3)
Voltage - Supply 2.5V~15V
Type High-side switch
Operating Temperature - -40℃~+125℃
Number of Channels 1
Control Input Logic Active High
RDS(on) 50mΩ

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Description

The SY6874DBC is a highly integrated power management IC (PMIC) designed for portable and battery-powered devices. It features multiple voltage regulators, including buck and boost converters, to efficiently manage power distribution. Key characteristics include:
- High Efficiency: Optimized for low power consumption, extending battery life.
- Multiple Outputs: Supports various voltage levels for different system components.
- Compact Design: Small footprint, ideal for space-constrained applications.
- Protection Features: Overvoltage, overcurrent, and thermal shutdown safeguards.
Commonly used in smartphones, tablets, and IoT devices, the SY6874DBC ensures stable and reliable power delivery. For detailed specifications, refer to the official datasheet.

Equivalent

The SY6874DBC is a power management IC for USB Type-C applications. Equivalent alternatives include:
- TI TPS65988 (USB PD controller)
- Cypress CYPD3174 (USB-C PD controller)
- NXP PTN5150A (USB Type-C port controller)
- ON Semiconductor FUSB302B (USB-C PD interface IC)
These chips offer similar USB Power Delivery (PD) and Type-C port control functionalities. Check datasheets for exact compatibility.

Manufacturer

The SY6874DBC is manufactured by Silergy Corp, a leading semiconductor company specializing in high-performance analog and mixed-signal ICs. Founded in 2007 and headquartered in China, Silergy focuses on power management solutions for consumer electronics, industrial, automotive, and computing applications. The company is known for its innovation in energy-efficient designs and has a strong presence in global markets. The SY6874DBC is likely a power management IC, reflecting Silergy's expertise in this domain.

Package

The SY6874DBC is typically available in a QFN (Quad Flat No-leads) package, commonly a 4x4mm or 3x3mm size with exposed pads for thermal dissipation. This compact, surface-mount package is suitable for power management ICs, offering efficient heat transfer and space-saving design. Exact dimensions may vary, so refer to the datasheet for precise details.

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