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TCTOP1A106M8R
+Lista de MateriaisP- CASE / 106- CAP CODE / POLY
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FabricanteKYOCERA AVX
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Peça do Fabricante #TCTOP1A106M8R
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Especificações
| Atributo | Valor |
| Series | TCTO |
| Part Status | Active |
| Capacitance | 10 µF |
| Tolerance | ±20% |
| Voltage - Rated | 10 V |
| Type | Molded |
| ESR (Equivalent Series Resistance) | 300mOhm @ 100kHz |
| Operating Temperature | -55°C ~ 105°C |
| Mounting Type | Surface Mount |
| Package / Case | 0805 (2012 Metric) |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Height - Seated (Max) | 0.047" (1.20mm) |
| Manufacturer Size Code | P |
| Features | High Reliability |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
Visão Geral
Description
- Typical use: decoupling and bulk storage on power rails in compact boards.
- How to confirm: look up the exact part number on the manufacturer’s datasheet or a distributor (DigiKey/Mouser). Verify footprint/package size, voltage rating, ESR, ripple current, and temperature rating.
- Quick field checks if you have the part: inspect polarity marking (tantalum/polymer caps have a marked positive lead), measure capacitance with an LCR meter, and compare against the circuit’s required voltage.
- If uncertain: provide the context (manufacturer, board, or a photo of the marking) to get an exact datasheet or a cross-reference.
Equivalent
Features
- Capacitance: 1 µF
- Tolerance: ±20%
- Dielectric: ceramic (often X7R or X5R)
- Voltage rating: varies by variant (commonly 50–250 V)
- Type/packaging: MLCC (SMD) or radial ceramic; RoHS compliant
- Temperature coefficient: dielectric-dependent (e.g., X7R)
For precise data (voltage, dielectric, size, ESR/ΔC), please share the datasheet or confirm the series/manufacturer.
Pinout
Manufacturer
Application
Common applications:
- Decoupling and local energy storage on low-voltage rails
- Ripple filtering in DC–DC converters and VRMs
- Bias stabilization in analog and audio circuits
- Power-supply smoothing in consumer electronics (laptops, tablets, TVs)
- Automotive and industrial electronics requiring compact, reliable caps
- IoT/wearables and other space-constrained boards