THGBMFG7C1LBAIL

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THGBMFG7C1LBAIL

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IC FLASH 128GBIT MMC 153FBGA

  • FabricanteKioxia America, Inc.

  • Peça do Fabricante #THGBMFG7C1LBAIL

  • Em Estoque3130

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Especificações

Atributo Valor
Part Status Obsolete
Base Product Number THGBMF
DigiKey Programmable Not Verified
Memory Format FLASH
Memory Size 128Gbit
Memory Interface MMC
Mounting Type Surface Mount
Supplier Device Package 153-FBGA (11.5x13)
Packaging Tray

Visão Geral

Description

The THGBMFG7C1LBAIL is a NAND flash memory chip manufactured by Toshiba, now part of Kioxia Corporation. It is designed for use in a variety of electronic devices such as smartphones, tablets, and other portable electronics that require reliable data storage solutions. This particular chip belongs to the e-MMC (embedded MultiMediaCard) family, which integrates NAND flash memory and a flash memory controller on a single die, simplifying the design and reducing the time-to-market for manufacturers.
Key features of the THGBMFG7C1LBAIL include high storage capacity, efficient data management, and enhanced performance. It supports features like the JEDEC standard interface for compatibility across various platforms and devices. The chip also includes wear leveling, bad block management, and error correction code (ECC) to ensure data integrity and longevity. Its compact form factor makes it suitable for space-constrained applications, while its low power consumption helps extend battery life in portable devices. Overall, the THGBMFG7C1LBAIL is a reliable and efficient choice for embedded storage solutions.

Equivalent

The THGBMFG7C1LBAIL chip is a NAND flash memory product, often used in embedded applications. Equivalent products may include similar NAND flash memory chips from other major manufacturers like Samsung, Micron, or SK Hynix. These equivalents would typically match in terms of storage capacity, interface, and other key specifications. It's important to verify compatibility by checking datasheets and technical specifications from the respective manufacturers.

Features

The THGBMFG7C1LBAIL is a NAND flash memory chip produced by Toshiba (now Kioxia). Here are its features:
1. Type: It is a NAND flash memory chip, typically used for data storage in various electronic devices.
2. Capacity: This model generally comes with a specific storage capacity, often found in eMMC configurations.
3. Technology: It utilizes advanced NAND technology, which might include 3D NAND for higher density and performance.
4. Performance: Offers fast read/write speeds suitable for mobile devices, embedded systems, and more.
5. Interface: Usually supports eMMC interface standards, providing reliable connectivity and data transfer.
6. Form Factor: Compact size, making it suitable for smartphones, tablets, and other space-constrained applications.
7. Power Efficiency: Designed to consume low power, extending battery life in portable devices.
8. Reliability: Includes error correction and wear leveling features for data integrity and longevity.
These features make the THGBMFG7C1LBAIL a versatile choice for manufacturers looking to integrate reliable flash storage into their products.

Pinout

The THGBMFG7C1LBAIL is a NAND flash memory module produced by Toshiba (now Kioxia). It is part of the e-MMC (embedded MultiMediaCard) family, which integrates NAND flash memory with a controller in a single package for improved performance and ease of use.
The THGBMFG7C1LBAIL typically comes in a Ball Grid Array (BGA) package format. The pin count for this type of e-MMC device can vary, but commonly they have a pin count that ranges from 153 to 169 balls, depending on the specific design and manufacturer specifications. This specific module is aimed at providing storage solutions for applications like smartphones, tablets, and other consumer electronics that require high-capacity storage and efficient data management.
The main functions of the THGBMFG7C1LBAIL include providing non-volatile storage for data, supporting boot operations, and handling various read and write operations efficiently. It offers advantages like wear leveling, bad block management, and error correction, thus ensuring data integrity and prolonged lifespan of the storage module.

Manufacturer

The THGBMFG7C1LBAIL is a model of NAND flash memory manufactured by Kioxia Corporation. Kioxia is a Japanese company that specializes in the production of flash memory and solid-state drives (SSDs). It was formerly known as Toshiba Memory Corporation before rebranding to Kioxia in 2019. The company is one of the leading suppliers in the semiconductor industry, particularly known for its advancements in flash memory technology. Kioxia develops and manufactures various types of memory products used in consumer electronics, data centers, and industrial applications.

Application

The THGBMFG7C1LBAIL is a type of NAND flash memory, commonly used in various electronic devices for data storage. Its application areas include smartphones, tablets, digital cameras, and other consumer electronics that require reliable and high-capacity storage solutions. It is also used in industrial applications such as embedded systems and automotive electronics, where robust performance and durability are essential. Additionally, this flash memory can be found in solid-state drives (SSDs) and portable storage devices, offering fast read and write speeds for efficient data handling. Its versatility makes it suitable for any application needing compact, non-volatile memory storage.

Package

The THGBMFG7C1LBAIL is a type of eMMC (embedded MultiMediaCard) flash memory package. It typically comes in a BGA (Ball Grid Array) package, which is common for eMMC devices, allowing for efficient storage integration in various electronic devices like smartphones and tablets.

Frequently Asked Questions


Q: What is the memory capacity of this Kioxia FLASH component?
A: It has a 128Gbit memory size, suitable for high-density data storage applications.


Q: What memory interface does the THGBMFG7C1LBAIL use?
A: It uses an MMC (MultiMediaCard) interface for reliable data communication.


Q: Is this component mounted on a surface or through-hole?
A: It supports Surface Mount (SMD) technology for compact PCB designs.


Q: What is the package type for this FLASH memory?
A: It comes in a 153-FBGA (Fine-pitch Ball Grid Array) package, measuring 11.5x13 mm.


Q: Is the THGBMFG7C1LBAIL still in active production?
A: No, its Part Status is marked as Obsolete, so it may not be available for new designs.


Q: What packaging format is used for delivery?
A: It is packaged in Tray format, typical for bulk handling during assembly.


Q: Can this memory be used for embedded storage in portable devices?
A: Yes, its FLASH format and MMC interface make it ideal for multimedia and embedded storage.


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