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TLSR8258F512ET48
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FabricanteTelink
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Peça do Fabricante #TLSR8258F512ET48
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Ficha Técnica TLSR8258F512ET48 DataSheet
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Especificações
| Atributo | Valor |
| OutputPower | 10 dBm |
| Package/Case | QFN-48 |
| MinimumOperatingTemperature | - 40 C |
| MaximumOperatingTemperature | + 85 C |
| MountingStyle | SMD/SMT |
| Packaging | Reel |
| Brand | Telink |
| ProductType | RF System on a Chip - SoC |
| FactoryPackQuantity:FactoryPackQuantity | 3000 |
| Subcategory | Wireless & RF Integrated Circuits |
| Type | BLE 5.1, multi-antenna AoA/AoD, BLE Mesh |
| Core | RISC |
| OperatingFrequency | 2.4 GHz |
| MaximumDataRate | 2 Mbps |
| Sensitivity | - 93 dBm |
| SupplyVoltage-Min | 1.8 V |
| SupplyVoltage-Max | 3.6 V |
| SupplyCurrentReceiving | 5.3 mA |
| SupplyCurrentTransmitting | 4.8 mA |
| ProgramMemorySize | 512 kB |
| ADCResolution | 14 bit |
| DataBusWidth | 32 bit |
| DataRAMSize | 64 kB |
| DataRAMType | SRAM |
| InterfaceType | I2C, I2S, SPI, UART, USB |
| MaximumClockFrequency | 32 MHz |
| MoistureSensitive | Yes |
| NumberofADCChannels | 10 Channel |
| NumberofI/Os | 32 I/O |
| NumberofTimers | 3 x 32 bit |
| Series | TLSR825X |
| Technology | Si |
| Tradename | 8258 |
| UnitWeight | 0.005834 oz |
Visão Geral
Description
Key features include 512KB of flash memory and 128KB of SRAM, providing ample storage for applications and data. The TLSR8258F512ET48 supports various wireless communication protocols, including Bluetooth 5.0, ensuring reliable connectivity across devices. It also offers multiple GPIOs, PWM, ADC, and UART interfaces for extensive peripheral integration.
The chip is designed for ease of use, with development support through various software development kits (SDKs) and tools, making it suitable for developers looking to create smart home devices, wearables, and other IoT solutions. Its robustness and flexibility make it a popular choice in the growing IoT landscape.
Equivalent
Features
1. Processor: It integrates a 32-bit ARM Cortex-M0 processor with a maximum clock speed of 64 MHz.
2. Memory: The chip includes 512 KB of Flash memory and 128 KB of SRAM, facilitating efficient data handling.
3. Bluetooth: Supports Bluetooth 5.0, enhancing data throughput and range.
4. Low Power Consumption: Optimized for battery-operated devices, with various low-power modes.
5. Integrated Peripherals: Features numerous I/O interfaces, including UART, SPI, I2C, ADC, and PWM, for versatile connectivity.
6. Security: Offers hardware-based encryption and secure boot capabilities to safeguard communications.
7. Operating Temperature: Designed to operate across a wide temperature range, suitable for various environments.
8. Development Support: Compatible with various development tools and platforms for ease of application development.
These features make the TLSR8258F512ET48 ideal for IoT, wearables, and other wireless applications.
Pinout
Key functions of the pins include:
- Power Supply (VDD): Provides power to the chip.
- Ground (GND): Common ground connection.
- I/O Ports: Various GPIO pins for general-purpose input/output, which can be configured for different functions such as PWM, ADC, and more.
- Communication Interfaces: Includes SPI, I2C, and UART for connectivity with other devices.
- Reset and Wake-up Pins: Used for resetting the chip and waking it from low-power modes.
- Analog Pins: For ADC functions to interface with sensors.
The chip is primarily utilized in IoT applications, wearable devices, and other Bluetooth-enabled products, providing efficient processing and communication capabilities in a compact form factor.
Manufacturer
Telink's products are known for their energy efficiency, robust performance, and support for multiple wireless protocols such as Bluetooth, Zigbee, and Wi-Fi. The TLSR8258F512ET48, specifically, is a Bluetooth 5.0 SoC (System on Chip) designed for low-power applications, offering features like high processing power, a rich set of peripherals, and extensive connectivity options.
As a prominent player in the semiconductor industry, Telink aims to empower developers with cutting-edge technology to create innovative connected devices, contributing to the growing ecosystem of smart technology.