TLSR8258F512ET48

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TLSR8258F512ET48

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Especificações

Atributo Valor
OutputPower 10 dBm
Package/Case QFN-48
MinimumOperatingTemperature - 40 C
MaximumOperatingTemperature + 85 C
MountingStyle SMD/SMT
Packaging Reel
Brand Telink
ProductType RF System on a Chip - SoC
FactoryPackQuantity:FactoryPackQuantity 3000
Subcategory Wireless & RF Integrated Circuits
Type BLE 5.1, multi-antenna AoA/AoD, BLE Mesh
Core RISC
OperatingFrequency 2.4 GHz
MaximumDataRate 2 Mbps
Sensitivity - 93 dBm
SupplyVoltage-Min 1.8 V
SupplyVoltage-Max 3.6 V
SupplyCurrentReceiving 5.3 mA
SupplyCurrentTransmitting 4.8 mA
ProgramMemorySize 512 kB
ADCResolution 14 bit
DataBusWidth 32 bit
DataRAMSize 64 kB
DataRAMType SRAM
InterfaceType I2C, I2S, SPI, UART, USB
MaximumClockFrequency 32 MHz
MoistureSensitive Yes
NumberofADCChannels 10 Channel
NumberofI/Os 32 I/O
NumberofTimers 3 x 32 bit
Series TLSR825X
Technology Si
Tradename 8258
UnitWeight 0.005834 oz

Visão Geral

Description

The TLSR8258F512ET48 is a versatile System-on-Chip (SoC) designed for IoT applications. It is part of the TLSR825x series developed by Tencent, featuring low power consumption and high efficiency, making it ideal for battery-operated devices. The chip integrates a powerful ARM Cortex-M4 processor with a floating-point unit, enabling complex computations and control tasks.
Key features include 512KB of flash memory and 128KB of SRAM, providing ample storage for applications and data. The TLSR8258F512ET48 supports various wireless communication protocols, including Bluetooth 5.0, ensuring reliable connectivity across devices. It also offers multiple GPIOs, PWM, ADC, and UART interfaces for extensive peripheral integration.
The chip is designed for ease of use, with development support through various software development kits (SDKs) and tools, making it suitable for developers looking to create smart home devices, wearables, and other IoT solutions. Its robustness and flexibility make it a popular choice in the growing IoT landscape.

Equivalent

The TLSR8258F512ET48 chip is a Bluetooth Low Energy (BLE) SoC by Telink. Equivalent products include the Nordic Semiconductor nRF52810, nRF52832, and nRF52840, as well as the Silicon Labs EFR32BG series and the Dialog Semiconductor DA14531. These alternatives also support BLE and have similar capabilities for low-power wireless applications. Be sure to check specific features and compatibility based on your project requirements.

Features

The TLSR8258F512ET48 is a low-power, highly-integrated System-on-Chip (SoC) primarily designed for Bluetooth Low Energy (BLE) applications. Key features include:
1. Processor: It integrates a 32-bit ARM Cortex-M0 processor with a maximum clock speed of 64 MHz.
2. Memory: The chip includes 512 KB of Flash memory and 128 KB of SRAM, facilitating efficient data handling.
3. Bluetooth: Supports Bluetooth 5.0, enhancing data throughput and range.
4. Low Power Consumption: Optimized for battery-operated devices, with various low-power modes.
5. Integrated Peripherals: Features numerous I/O interfaces, including UART, SPI, I2C, ADC, and PWM, for versatile connectivity.
6. Security: Offers hardware-based encryption and secure boot capabilities to safeguard communications.
7. Operating Temperature: Designed to operate across a wide temperature range, suitable for various environments.
8. Development Support: Compatible with various development tools and platforms for ease of application development.
These features make the TLSR8258F512ET48 ideal for IoT, wearables, and other wireless applications.

Pinout

The TLSR8258F512ET48 is a low-power, highly integrated System-on-Chip (SoC) designed for Bluetooth Low Energy applications. It features a 48-pin QFN package.
Key functions of the pins include:
- Power Supply (VDD): Provides power to the chip.
- Ground (GND): Common ground connection.
- I/O Ports: Various GPIO pins for general-purpose input/output, which can be configured for different functions such as PWM, ADC, and more.
- Communication Interfaces: Includes SPI, I2C, and UART for connectivity with other devices.
- Reset and Wake-up Pins: Used for resetting the chip and waking it from low-power modes.
- Analog Pins: For ADC functions to interface with sensors.
The chip is primarily utilized in IoT applications, wearable devices, and other Bluetooth-enabled products, providing efficient processing and communication capabilities in a compact form factor.

Manufacturer

The TLSR8258F512ET48 is manufactured by Telink Semiconductor, a company that specializes in developing wireless communication solutions and low-power microcontrollers. Founded in 2009 and headquartered in Shanghai, China, Telink focuses on providing highly integrated ICs for various applications, including the Internet of Things (IoT), smart home devices, and wearables.
Telink's products are known for their energy efficiency, robust performance, and support for multiple wireless protocols such as Bluetooth, Zigbee, and Wi-Fi. The TLSR8258F512ET48, specifically, is a Bluetooth 5.0 SoC (System on Chip) designed for low-power applications, offering features like high processing power, a rich set of peripherals, and extensive connectivity options.
As a prominent player in the semiconductor industry, Telink aims to empower developers with cutting-edge technology to create innovative connected devices, contributing to the growing ecosystem of smart technology.

Application

The TLSR8258F512ET48 is a low-power Bluetooth SoC (System on Chip) designed for various applications including smart home devices, health monitoring systems, wearable technology, industrial automation, and remote sensor networks. Its energy efficiency and integration capabilities make it suitable for IoT applications, enabling seamless connectivity and data transmission. Additionally, it can be used in consumer electronics, such as Bluetooth headphones, smart appliances, and personal fitness trackers, benefiting from its compact size and high performance.

Package

The TLSR8258F512ET48 is packaged in a QFN (Quad Flat No-lead) format, specifically in a 48-pin configuration. This compact package type is designed for efficient thermal performance and space-saving in electronic applications.

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