TPS82674SIPR

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TPS82674SIPR

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DC DC CONVERTER 1.2V 0.72W

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Especificações

Atributo Valor
Series MicroSip™
PartStatus Active
Type Non-Isolated PoL Module
NumberofOutputs 1
Voltage-Input(Min) 2.3V
Voltage-Input(Max) 4.8V
Voltage-Output1 1.2V
Current-Output(Max) 600mA
Applications ITE (Commercial)
Features Remote On/Off, OCP, OTP, UVLO
OperatingTemperature -40°C ~ 85°C
Efficiency 90%
MountingType Surface Mount
Package/Case 8-SMD Module
Size/Dimension 0.12" L x 0.09" W x 0.04" H (3.0mm x 2.4mm x 1.0mm)
ControlFeatures Enable, Active High
BaseProductNumber TPS82674
SupplierDevicePackage 8-uSIP (2.9x2.3)

Visão Geral

Description

The TPS82674SIPR is a microSiP DC-DC step-down power module produced by Texas Instruments, designed for high-efficiency power management in compact electronics. It integrates a synchronous buck converter and inductor within a small package, minimizing the need for external components. The module delivers a fixed output voltage efficiently from a wide input voltage range, making it suitable for battery-powered and energy-sensitive applications.
Key features include a high switching frequency, low quiescent current, and excellent transient response, which contribute to extended battery life and reliable performance. Its compact size and high power density make it ideal for use in space-constrained devices like wearables, portable electronics, and IoT gadgets. The TPS82674SIPR also incorporates various safety features, including thermal shutdown, current limit protection, and undervoltage lockout, ensuring robust operation under different conditions.
Overall, the TPS82674SIPR offers a convenient and efficient solution for designers looking to optimize power management in compact electronic devices.

Equivalent

The TPS82674SIPR is a step-down converter microSiP module from Texas Instruments. Equivalent products include:
1. MAXM17532 - from Maxim Integrated, offering a similar high-efficiency step-down conversion.
2. LTM4644 - from Analog Devices, another DC-DC step-down converter.
3. MIC33163 - from Microchip Technology, designed for similar applications.
These alternatives may vary in specifications such as input voltage range, output current, and package type, so it's important to verify compatibility with your specific application.

Features

The TPS82674SIPR is a microSiP DC-DC step-down power module from Texas Instruments. It features a highly efficient design with a focus on space-saving, integrating a high-performance inductor and passive components within a compact package. Key features include:
1. High Efficiency: Capable of achieving up to 90% efficiency, suitable for battery-powered applications.
2. Compact Size: Comes in a microSiP package measuring just 6.0 mm x 6.7 mm x 1.5 mm, ideal for space-constrained designs.
3. Output Current: Supports a continuous output current of up to 600 mA.
4. Wide Input Voltage Range: Operates efficiently with an input voltage range of 2.3 V to 5.5 V.
5. Adjustable Output Voltage: Offers adjustable output voltages from 0.85 V to 4 V, providing versatility for various applications.
6. Integrated Components: Minimizes external components, reducing overall system design complexity.
7. Low Quiescent Current: Features a low quiescent current operation, prolonging battery life in portable devices.
Overall, the TPS82674SIPR is designed for efficient power conversion in compact form factors, suitable for a range of applications including mobile devices and wearables.

Pinout

The TPS82674SIPR is a MicroSiP DC-DC step-down power module from Texas Instruments, designed to provide a highly efficient power conversion solution. This module is encapsulated in a compact package, making it suitable for space-constrained applications.
It has a pin count of 9. The function of these pins typically includes:
1. VIN: The input voltage supply pin where the input voltage is applied.
2. VOUT: The output voltage pin that delivers the regulated output voltage.
3. GND: Ground pin for the module.
4. EN: Enable pin to turn the device on or off.
5. FB: Feedback pin used to set the output voltage.
6. PG: Power good indicator pin that signals when the output voltage is within regulation.
7. NC: No connect pins which are typically not used in the circuit.
8. SS/TR: Soft-start or tracking pin for controlling the output voltage rise time.
9. AVIN: Analog input voltage pin for powering internal circuits.
These modules are commonly used in portable and battery-powered devices due to their efficiency and small size. For precise pin configuration and functions, consulting the official datasheet from Texas Instruments is recommended.

Manufacturer

The TPS82674SIPR is manufactured by Texas Instruments. Texas Instruments is a global semiconductor company known for designing and manufacturing a wide range of electronic products. They specialize in the production of analog and embedded processing chips, which are used in various applications such as industrial, automotive, personal electronics, and communications equipment. As a leader in the semiconductor industry, Texas Instruments focuses on innovation and technology development to deliver high-performance and energy-efficient solutions.

Application

The TPS82674SIPR is a high-efficiency, step-down DC-DC converter primarily used in compact electronic devices. Its key application areas include:
1. Smartphones and Tablets: Provides efficient power management for prolonged battery life.
2. Portable Media Players: Enhances power supply efficiency for audio and video components.
3. Wearables: Supports miniaturized power solutions in fitness trackers and smartwatches.
4. IoT Devices: Offers reliable power conversion for various IoT applications.
5. Wireless Communication Modules: Ensures stable power supply for RF components.
6. Digital Cameras: Powers image processing units and other electronic components.
These applications benefit from its compact size, high efficiency, and low power consumption.

Package

The TPS82674SIPR is a microSiP DC-DC step-down power module from Texas Instruments. It typically comes in a compact package suitable for portable applications, integrating an inductor and passive components in a 9-bump, 1.9 x 2.3 mm package. This design helps in simplifying the power supply design and reducing the overall solution size for low-power applications.

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