Description
The TSI564A-10GCLY is a high-performance PCI Express (PCIe) switch designed for demanding computing applications. It caters to environments requiring efficient and flexible I/O connectivity, offering numerous ports and lanes to facilitate multiple high-speed PCIe connections. This model is known for its low-latency and high-throughput capabilities, making it a suitable choice for enterprise servers, storage systems, and networking equipment.
Key features of the TSI564A-10GCLY include support for PCIe Gen2, which provides double the bandwidth compared to Gen1, ensuring faster data transfer rates. It is also equipped with advanced features like adaptive routing, error handling, and quality of service (QoS) mechanisms that enhance performance and reliability. These capabilities make it ideal for applications that demand high data integrity and seamless data flow.
The switch typically supports hot-plugging and various power management features, allowing for energy efficiency and ease of maintenance. Overall, the TSI564A-10GCLY is a robust solution for enhancing the connectivity and performance of high-end computing platforms.
Equivalent
The TSI564A-10GCLY is a PCI Express-to-PCI bridge often used in embedded applications. Equivalent products might include similar PCIe-to-PCI bridge solutions offered by Broadcom (formerly PLX Technology), such as the PEX series chips like the PEX8111. Other manufacturers like Texas Instruments and IDT (Integrated Device Technology) may offer alternative bridge solutions. Always verify specifications to ensure compatibility with your specific requirements.
Features
The TSI564A-10GCLY is a PCI Express-to-PCI/PCI-X bridge that supports the seamless integration of PCI Express technology with existing PCI/PCI-X systems. Key features include:
1. High Performance: It supports a 10 Gbps non-blocking throughput, ensuring efficient data transfer between PCI Express and PCI/PCI-X buses.
2. Compatibility: The device is compatible with both PCI-X 1.0 and PCI 2.3 standards, allowing it to work with a wide range of legacy systems.
3. Lane Configuration: It typically supports a 1-lane (x1) PCI Express interface, though configurations may vary based on specific models.
4. Latency Optimization: The bridge is designed to minimize latency, enhancing overall system performance.
5. Hot-Plug Capability: It features hot-plug support, facilitating maintenance and upgrades without downtime.
6. Error Handling: Advanced error detection and reporting mechanisms help maintain system reliability and integrity.
7. Power Management: It includes power management features compliant with PCI Express standards.
These features make the TSI564A-10GCLY a versatile choice for system designers looking to integrate PCI Express into existing infrastructures.
Pinout
The TSI564A-10GCLY is a component from Texas Instruments, specifically a PCIe-to-PCI/PCI-X bridge. It features 676 pins. The chip facilitates bridging between PCI Express and PCI/PCI-X interfaces, providing seamless connectivity between these different bus architectures. This is particularly useful in systems that require legacy support for PCI/PCI-X while utilizing the newer, high-speed PCI Express standard. The TSI564A-10GCLY is designed to support various applications, including networking, storage, and communications systems, by enabling efficient data transfer and maintaining high performance across different bus technologies.
Manufacturer
The TSI564A-10GCLY is manufactured by Texas Instruments (TI). Texas Instruments is a global semiconductor company that designs and manufactures a broad range of analog and embedded processing chips. The company's products are used in various industries, including consumer electronics, automotive, industrial, and communications equipment. TI is known for its innovation in the semiconductor sector, providing essential components that enable electronic devices to function.
Application
The TSI564A-10GCLY is commonly used in applications that require advanced data processing and high-speed connectivity. Typical areas include telecommunications, networking systems, and data storage solutions, where it facilitates efficient data transfer and management. It’s also utilized in high-performance computing environments and embedded systems, enabling seamless communication between various components. Additionally, it's suitable for use in industrial automation and instrumentation systems, where reliable and quick data handling is crucial.
Package
The TSI564A-10GCLY is a microchip packaged in a 31 x 31 mm, 675-ball FCBGA (Flip-Chip Ball Grid Array) format. This package type is designed for high-performance applications, providing efficient thermal management and electrical connectivity for complex semiconductor devices.