TSI578A-10GIL

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TSI578A-10GIL

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IC SER RAPIDIO SWITCH 399FCBGA

  • FabricanteRenesas Electronics America Inc.

  • Peça do Fabricante #TSI578A-10GIL

  • Pacote BBGA-399

  • Em Estoque2703

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Especificações

Atributo Valor
Package Tray
ProductStatus Obsolete
Type Serial RapidIO® Switch
Applications Wireless Infrastructure
MountingType Surface Mount
Package/Case 399-BBGA, FCBGA

Visão Geral

Description

The TSI578A-10GIL is a high-performance switch device designed for use in advanced computing systems, particularly those requiring rapid data transfer and low latency. It's typically employed in high-speed networking applications, such as data centers and high-performance computing (HPC) environments. This switch is notable for its 10Gbps link interface, which facilitates efficient data communication across multiple channels.
Key features of the TSI578A-10GIL include its robust architecture that supports high-throughput and scalable connectivity. It provides advanced routing capabilities, ensuring efficient data packet management and reducing bottlenecks in network traffic. The switch is designed to be energy-efficient, making it a viable option for environments where power consumption is a critical consideration.
Overall, the TSI578A-10GIL is ideal for applications that demand reliable, high-speed networking solutions. Its versatility and efficiency make it suitable for modern IT infrastructure, supporting the growing demands for data processing and transfer in various technological fields.

Equivalent

The TSI578A-10GIL is a RapidIO switch from IDT (Integrated Device Technology). Equivalent products would include other RapidIO switches with similar specifications from manufacturers like Texas Instruments or Broadcom. Look for chips that support similar bandwidth, port count, and RapidIO protocol versions, such as the Texas Instruments' Tsi57x family or comparable offerings from other network switch manufacturers. Always check the latest product lines for updated equivalents.

Features

The TSI578A-10GIL is a high-performance RapidIO switch designed for efficient data routing in embedded systems. Key features include:
1. 10 Gbps Connectivity: Offers high-speed data transfer rates up to 10 Gbps, facilitating fast communication between connected devices.
2. RapidIO Protocol Support: Complies with the RapidIO interconnect standard, providing low-latency, high-bandwidth connectivity suited for real-time applications.
3. Scalability: Supports multiple ports, enabling flexible system expansion and integration of several devices without compromising performance.
4. Low Power Consumption: Designed for efficient energy use, making it suitable for power-sensitive applications.
5. Advanced QoS (Quality of Service): Ensures reliable data transmission with features like traffic prioritization and congestion management.
6. Error Management: Includes robust error detection and correction mechanisms to maintain data integrity and system reliability.
7. Compact Design: Suitable for use in space-constrained environments, common in embedded and industrial systems.
8. Flexible Configuration: Offers programmable options for customized routing and system setup to cater to specific application needs.
These features make the TSI578A-10GIL ideal for use in telecommunications, data centers, and other high-demand computing environments.

Pinout

The TSI578A-10GIL is a RapidIO switch from IDT (Integrated Device Technology). Typically, the TSI578 comes in a 19 mm x 19 mm, 324-pin BGA (Ball Grid Array) package. It is designed to support high-performance interconnects for embedded systems.
The TSI578A-10GIL functions as a high-speed, low-latency switch that supports multiple lanes of Serial RapidIO, allowing for efficient data transfer in applications such as telecommunications, wireless infrastructure, and data centers. It enables the routing of data packets between multiple endpoints, providing high throughput and low latency.
Please consult the specific part datasheet or contact IDT for the most accurate and detailed information about the pin count and function, as there may be variations or updates in specific models or revisions.

Manufacturer

The TSI578A-10GIL is manufactured by Brocade Communications Systems, Inc. Brocade was a company known for specializing in data and storage networking products, including network switches, routers, and other associated hardware and software. Founded in 1995 and headquartered in San Jose, California, Brocade primarily focused on providing solutions for Enterprise Storage Area Networks (SANs) and IP networking.
While Brocade established itself as a key player in network infrastructure, it underwent significant changes in its business structure over time. In 2017, the company was acquired by Broadcom Inc., a global technology company that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions. Following this acquisition, Brocade's networking business was integrated into Broadcom's larger portfolio, and its storage networking products and expertise became part of Broadcom's offerings.
As a part of Broadcom, the legacy of Brocade continues under a larger umbrella, with a focus on providing cutting-edge networking solutions for a variety of applications across different industries.

Application

The TSI578A-10GIL is a high-performance switch typically used in high-speed computing and networking applications. Its primary application areas include high-performance computing (HPC) clusters, data centers, and enterprise networks. It facilitates efficient data transfer and communication between multiple processors, enhancing overall system performance. Additionally, it is used in storage area networks (SANs) and in the development of embedded systems that require robust data routing and low-latency communication. Its advanced features make it suitable for use in complex network architectures that demand high throughput and reliability.

Package

The TSI578A-10GIL is typically housed in a BGA (Ball Grid Array) package, which is common for high-performance integrated circuits. This packaging type allows for efficient heat dissipation and reliable connections through solder balls arranged in a grid on the underside of the chip.

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