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TXB0104DR
+Lista de MateriaisIC TRNSLTR BIDIRECTIONAL 14SOIC
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FabricanteTexas Instruments
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Peça do Fabricante #TXB0104DR
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Pacote SOIC-14
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Especificações
| Atributo | Valor |
| Package | Tape & Reel (TR),Cut Tape (CT),Bulk |
| ProductStatus | Active |
| TranslatorType | Voltage Level |
| ChannelType | Bidirectional |
| NumberofCircuits | 1 |
| ChannelsperCircuit | 4 |
| Voltage-VCCA | 1.2 V ~ 3.6 V |
| Voltage-VCCB | 1.65 V ~ 5.5 V |
| OutputType | Tri-State, Non-Inverted |
| DataRate | 100Mbps |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| Features | Auto-Direction Sensing |
| MountingType | Surface Mount |
| Package/Case | 14-SOIC (0.154, 3.90mm Width) |
Visão Geral
Description
Key features of the TXB0104DR include automatic direction sensing, which eliminates the need for a direction-control signal, making it easy to use. It provides up to 100 Mbps data rates for push-pull applications and up to 24 Mbps for open-drain applications, ensuring efficient data transmission across the voltage barriers.
The TXB0104DR comes in a small, space-efficient package, making it suitable for applications where board space is limited. Its wide power supply range and robust ESD protection enhance reliability and flexibility across various applications, including mobile devices, computing, and consumer electronics. Overall, the TXB0104DR offers a reliable solution for simplifying voltage level translation in complex electronic systems.
Equivalent
1. NXP Semiconductor’s 74LVC4245A.
2. ON Semiconductor’s NLSX4373.
3. Microchip’s MCP4704.
These alternatives serve similar functions, facilitating voltage level translation between different logic levels in electronic circuits. Always compare datasheets to ensure compatibility with your specific application requirements.
Features
1. Wide Voltage Range: Supports a range from 1.2 V to 3.6 V on both sides (VCCA and VCCB), allowing interfacing between different logic levels without additional components.
2. Automatic Direction Sensing: Automatically configures the data direction, eliminating the need for a directional control signal.
3. High-Speed Translation: Capable of high-speed operation, making it suitable for applications requiring fast data rates.
4. Open-Drain Support: Compatible with open-drain drivers through its internal pull-up resistors.
5. Low Power Consumption: Features low static power dissipation and reduces power draw in idle states.
6. Compact Package: Available in small form factor packages like the TSSOP and VSSOP, suitable for space-constrained designs.
7. ESD Protection: Built-in Electrostatic Discharge (ESD) protection enhances device robustness and reliability.
These features make the TXB0104DR suitable for interfacing between different logic level devices in a variety of electronic applications.
Pinout
The TXB0104DR comes in a 14-pin SOIC (Small Outline Integrated Circuit) package. The pin count and functions are as follows:
1. VCCA: Supply voltage for the A ports.
2. A1-A4: Channel A data ports.
3. OE: Output Enable. Active-high; when low, all outputs are placed in a high-impedance state.
4. VCCB: Supply voltage for the B ports.
5. B1-B4: Channel B data ports.
6. GND: Ground reference.
The VCCA and VCCB pins accept voltage levels ranging from 1.2 V to 3.6 V and 1.65 V to 5.5 V, respectively, making it suitable for level translation between various logic levels, such as from 1.8 V to 3.3 V or from 2.5 V to 5 V. The device also features auto-direction sensing, eliminating the need for direction control.
Manufacturer
Application
1. Microcontroller Interfacing: Facilitates communication between microcontrollers operating at different voltages.
2. Peripheral Connectivity: Connects various peripherals like sensors, displays, or modules to a main processor with differing voltage levels.
3. Communication Protocols: Used in I²C, SPI, UART interfaces to ensure compatibility between devices with different power supply voltages.
4. Consumer Electronics: Integrates into devices like smartphones and tablets for interfacing internal components.
5. Embedded Systems: Provides voltage translation in embedded applications where multiple voltage domains exist.
Its compact package makes it suitable for space-constrained designs.