XC2C512-10FGG324I

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XC2C512-10FGG324I

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IC CPLD 512MC 9.2NS 324FBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XC2C512-10FGG324I

  • Pacote FBGA-324

  • Em Estoque4802

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Especificações

Atributo Valor
Package / Case Tray
Series CoolRunner II
Part Status Active
Programmable Type In System Programmable
Delay Timetpd(1)Max 9.2 ns
Voltage Supply - Internal 1.7V ~ 1.9V
Number of Logic Elements/Blocks 32
Number of Macrocells 512
Number of Gates 12000
Number of I/O 270
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

Visão Geral

Description

The XC2C512-10FGG324I is a member of the CoolRunner-II CPLD (Complex Programmable Logic Device) family by Xilinx, designed for a variety of applications requiring low power consumption and high performance. This specific model features 512 macrocells and is housed in a 324-pin Fine-Pitch Ball Grid Array (FGG) package. Operating at a maximum speed of 10 nanoseconds, it is suitable for applications needing quick data processing.
The device supports advanced system integration with features like fast propagation delay and low standby power, thanks to its CoolRunner-II technology. It operates with a core voltage of 1.8V and I/O voltages ranging from 1.5V to 3.3V, providing flexibility for interfacing with different voltage levels.
The "I" in the part number indicates that the device is rated for industrial temperature ranges, making it suitable for demanding environments. This CPLD is often used in consumer electronics, telecommunications, and automotive applications where reliable, efficient performance is critical. Its reprogrammable nature allows developers to implement custom logic designs tailored to specific needs.

Equivalent

The XC2C512-10FGG324I is a Xilinx CoolRunner-II CPLD. Equivalent products are CPLDs with similar features from other manufacturers, such as the Altera (now Intel) MAX II series, specifically the EPM570 series, or the Lattice Semiconductor MachXO series. These alternatives should match in terms of logic elements, I/O pins, and package type to serve as suitable replacements, but exact feature and performance alignment should be verified against specific application requirements.

Features

The XC2C512-10FGG324I is a member of Xilinx's CoolRunner-II family of CPLDs (Complex Programmable Logic Devices). Key features include:
1. Logic Capacity: It has 512 macrocells.
2. Performance: Offers a maximum pin-to-pin delay of 10 ns.
3. Power Consumption: Designed for low-power operation, making it suitable for battery-powered and portable applications.
4. Package: Comes in a 324-pin Fine-Pitch Ball Grid Array (FBGA) package.
5. Operating Temperature: Industrial-grade, supporting a temperature range of -40°C to +100°C.
6. I/O Pins: Offers a flexible I/O architecture with a total of 279 user I/O pins, supporting various I/O standards.
7. Voltage: Operates at a core voltage of 1.8V with I/O voltage flexibility ranging from 1.5V to 3.3V.
8. Security: Features data protection capabilities with security bits to prevent unauthorized access and copying of designs.
9. Programming: Supports JTAG programming and in-system programmability.
This CPLD is well-suited for applications requiring high-density logic with low power and high performance.

Pinout

The XC2C512-10FGG324I is a member of the Xilinx CoolRunner-II CPLD (Complex Programmable Logic Device) family. It comes in a Fine-Pitch Ball Grid Array (FBGA) package, specifically with 324 pins. This device is designed for high-performance, low-power applications and offers a density of 512 macrocells.
Key features and functions include:
- Low Power Consumption: The device is optimized for power efficiency, making it suitable for battery-powered and portable applications.
- High-Speed Operation: With a 10 ns pin-to-pin logic delay, it supports fast processing speeds.
- I/O Flexibility: It offers a wide range of I/O standards and the option for hot-swappable I/Os, making it adaptable for various interfacing requirements.
- In-System Programming (ISP): Supports JTAG for easy programming and configuration updates.
- Non-volatile Technology: Retains its configuration even when the power is off, which is essential for reliable operation in various environments.
This device is suitable for applications requiring complex logic functions, such as data processing, signal interfacing, and control operations.

Manufacturer

The XC2C512-10FGG324I is manufactured by Xilinx, Inc. Xilinx is a company that specializes in designing and producing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and other related technologies. As a leading entity in the semiconductor industry, Xilinx is known for its innovation in programmable logic solutions, enabling a wide range of applications across various sectors such as telecommunications, automotive, consumer electronics, and data centers.
The XC2C512-10FGG324I specifically belongs to the CoolRunner-II CPLD family, known for low power consumption and high performance, making it suitable for diverse applications that require fast and efficient processing. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a multinational semiconductor company, broadening its reach and integrating its technologies into AMD’s diverse product portfolio.

Application

The XC2C512-10FGG324I is a CPLD (Complex Programmable Logic Device) from Xilinx's CoolRunner-II family. It is typically used in applications that require low-power consumption and high-performance logic processing. Key application areas include digital signal processing, data communication, interfacing, and control systems. It's suitable for use in consumer electronics, industrial automation, automotive systems, and telecommunications equipment. The device can be employed for tasks such as glue logic, protocol bridging, and fast I/O processing due to its reprogrammable nature and efficient power usage.

Package

The XC2C512-10FGG324I is a CPLD (Complex Programmable Logic Device) from Xilinx's CoolRunner-II family. It comes in an FGG324 package, which is a Fine-pitch Ball Grid Array (FBGA) with 324 pins. This package type is designed for high-density applications and offers efficient power consumption features suitable for various applications requiring programmable logic.

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