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XC2C512-10FTG256I
+Lista de MateriaisIC CPLD 512MC 9.2NS 256FTBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC2C512-10FTG256I
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Pacote FTBGA-256
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Em Estoque3587
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | CoolRunner II |
| Part Status | Active |
| Programmable Type | In System Programmable |
| Delay Timetpd(1)Max | 9.2 ns |
| Voltage Supply - Internal | 1.7V ~ 1.9V |
| Number of Logic Elements/Blocks | 32 |
| Number of Macrocells | 512 |
| Number of Gates | 12000 |
| Number of I/O | 212 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Visão Geral
Description
Key features include fast pin-to-pin delays, low dynamic power consumption, and support for a wide range of supply voltages, enhancing its versatility in various applications. The device supports in-system programming (ISP), allowing for easy updates and modifications without removing the chip from a circuit. Additionally, it is equipped with advanced clock management and flexible I/O options, enabling efficient design implementation.
The "I" in the part number indicates an industrial-grade temperature range, making it suitable for harsh environments. This device is commonly used in consumer electronics, telecommunications, and industrial automation applications.
Equivalent
1. Lattice Semiconductor's ispMACH 4000 series.
2. Altera (now Intel) MAX II series.
Always check the specific requirements and compatibility for your application when selecting an equivalent.
Features
1. High Capacity: Offers 512 macrocells, suitable for complex designs.
2. Performance: Capable of operating at speeds up to 10 ns.
3. Low Power Consumption: Utilizes advanced CMOS technology for reduced power usage, ideal for battery-powered and portable applications.
4. Voltage Range: Supports a wide range from 1.5V to 3.3V.
5. Packaging: Available in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.
6. I/O Flexibility: Provides multiple I/O standards compatibility, including LVCMOS and LVTTL.
7. JTAG Support: Comes with IEEE 1149.1 boundary-scan support for testing and debugging.
8. Design Tools: Compatible with Xilinx ISE design tools for synthesis and simulation.
These features make the XC2C512-10FTG256I suitable for applications requiring high performance, low power, and flexibility in programmable logic design.
Pinout
The device is designed for high-performance and low-power applications, suitable for a variety of digital logic functions. It offers advanced features such as fast propagation delays, low static and dynamic power consumption, and in-system programming via JTAG. The device is ideal for implementing complex digital logic designs, including state machines, data controllers, and complex combinational logic.
The 256 pins on the package allow for extensive I/O capabilities, making it versatile for interfacing with other digital components in a system. Each pin can be configured for different functions, including input, output, and bidirectional capabilities, depending on the design requirements. The device is well-suited for applications requiring high pin count and moderate logic density, providing a balance between functionality and power efficiency.