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XC2S200-5FG256C
+Lista de MateriaisIC FPGA 176 I/O 256FBGA
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FabricanteAMD
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Peça do Fabricante #XC2S200-5FG256C
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Especificações
| Atributo | Valor |
| Series | Spartan®-II |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of I/O | 176 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
| Base Product Number | XC2S200 |
| Number of LABs/CLBs | 1176 |
| Number of Gates | 200000 |
Visão Geral
Description
Housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package, the XC2S200-5FG256C supports high-density board designs. Its architecture includes a rich set of configurable logic blocks (CLBs), distributed RAM, and dedicated resources for implementing complex logic functions. Additionally, the device offers a variety of input/output (I/O) options, allowing for flexible interfacing with other components.
The Spartan-II series focuses on delivering a balance between performance, logic density, and cost, making the XC2S200-5FG256C an ideal choice for applications in communication systems, consumer electronics, and industrial control systems. Its programmability enables designers to iterate and optimize designs rapidly, and its robust feature set supports the development of efficient and reliable electronic systems.
Equivalent
1. Altera (now Intel) Cyclone series, such as the EP1C20.
2. Lattice Semiconductor's LatticeXP or MachXO series.
3. Microsemi (now Microchip) IGLOO series.
Ensure compatibility by checking specific feature sets, performance, and package requirements.
Features
1. Logic Capacity: It offers approximately 200,000 system gates.
2. CLBs: Contains around 2,160 Configurable Logic Blocks (CLBs) for implementing combinational and sequential logic.
3. I/O Pins: Comes with 176 user I/O pins, facilitating extensive connectivity options.
4. On-Chip Memory: Features 14,336 bits of distributed RAM for efficient data storage and retrieval.
5. Performance: Operates at speeds up to 200 MHz, suitable for high-performance applications.
6. Packaging: Available in a fine-pitch 256-ball grid array (FG256), optimizing space and thermal performance.
7. Clock Management: Includes four Delay-Locked Loops (DLLs) for advanced clock distribution and management.
8. Voltage: Core voltage of 2.5V with support for multiple I/O standards.
9. Design Tools: Compatible with Xilinx ISE design suite for development and configuration.
These features make it a versatile choice for a range of applications, from consumer electronics to communication systems.
Pinout
1. Logic Gates and Flip-Flops: Provides numerous configurable logic blocks for implementing combinatorial and sequential circuits.
2. I/O Blocks: Supports flexible I/O standards and interfaces, allowing it to connect with other devices and components.
3. Embedded Memory: Contains block RAM for temporary data storage and buffering.
4. Clock Management: Equipped with resources for managing clock signals, including delay-locked loops (DLLs).
5. Programmability: Enables reconfiguration for different applications, supporting custom logic designs via hardware description languages (HDLs).
These features make the XC2S200-5FG256C ideal for diverse applications, from simple logic circuits to more complex digital systems.
Manufacturer
Application
1. Consumer electronics, for implementing custom digital circuits.
2. Telecommunications, for signal processing and data routing.
3. Industrial automation, for control systems and data acquisition.
4. Networking, for protocol implementation and data processing.
5. Automotive, for in-vehicle networking and control systems.
Its flexibility and cost-effectiveness make it ideal for applications requiring moderate logic density and performance.