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XC3S1200E-4FGG400C
+Lista de MateriaisIC FPGA 304 I/O 400FBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC3S1200E-4FGG400C
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Pacote FBGA-400
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-3E |
| Part Status | Active |
| Number of LABs/CLBs | 2168 |
| Number of Logic Elements/Cells | 19512 |
| Total RAM Bits | 516096 |
| Number of I/O | 304 |
| Number of Gates | 1200000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
Key features include 24,576 logic cells, up to 504 user I/O pins, and support for various I/O standards, making it versatile for a range of electronic designs. The FPGA has multiple Digital Clock Managers (DCMs) for advanced clock management and integrates block RAM, allowing efficient data storage and retrieval.
The "-4" in the part number indicates the speed grade, with lower numbers representing faster performance. The Spartan-3E series is known for its affordability, making it ideal for consumer electronics, communications, and industrial applications. Additionally, its reprogrammable nature allows for design flexibility and iterative testing, which is valuable in prototyping and development phases.
Equivalent
Features
1. Logic Cells: Contains 1,200,000 system gates.
2. Configurable Logic Blocks (CLBs): Equipped with an array of CLBs, facilitating complex logic designs.
3. I/O Pins: Provides 311 user I/O pins, supporting a variety of I/O standards.
4. Memory: Includes Block RAM totaling 52 Kbits for storage applications.
5. Clock Management: Features Digital Clock Managers (DCMs) for reliable clock distribution and management.
6. Speed Grade: The "-4" designation indicates its speed grade, offering good performance for a range of applications.
7. Package: Comes in an FGG400 package, which is a Fine-Pitch Ball Grid Array (FBGA) with 400 pins.
8. Low Power: Designed for low power consumption, making it suitable for power-sensitive applications.
9. Applications: Ideal for consumer electronics, industrial automation, and communication systems.
These features make the XC3S1200E-4FGG400C a versatile choice for a variety of digital circuit design applications.
Pinout
The XC3S1200E provides approximately 1,200,000 system gates and includes features such as Block RAM, Digital Clock Managers (DCMs), and multipliers, making it suitable for digital signal processing, embedded controllers, and other logic-intensive applications. The pins in this package are utilized for various purposes including I/O connections, power supply, programming, and configuration.
The FPGA uses its pins for multiple functions: input/output operations, dedicated clock inputs, JTAG programming and debugging, configuration via SPI or other modes, and power/ground connections. The specific function of each pin is defined in the device’s datasheet and user guide, which also provide guidelines for proper connection and use in circuit designs.
Manufacturer
Xilinx's technologies enable the development of flexible and adaptive hardware solutions, allowing for efficient and effective design processes. The company's products are integral to many industries, offering high performance, scalability, and customization. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), another major player in the semiconductor industry, further strengthening its position in the market. This acquisition aimed to create a leader in high-performance and adaptive computing solutions. Xilinx's innovation and expertise continue to drive advancements in programmable logic and adaptive computing technologies.