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XC3S1200E-4FTG256C
+Lista de MateriaisIC FPGA 190 I/O 256FTBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC3S1200E-4FTG256C
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Pacote BGA-256
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-3E |
| Part Status | Active |
| Number of LABs/CLBs | 2168 |
| Number of Logic Elements/Cells | 19512 |
| Total RAM Bits | 516096 |
| Number of I/O | 190 |
| Number of Gates | 1200000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
The device is housed in a 256-pin Fine-pitch Thin Ball Grid Array (FTBGA) package, which is denoted by "FTG256C". It operates at a speed grade of "-4", indicating its relative performance within the Spartan-3E series. The FPGA includes a range of features such as embedded multipliers, block RAM, and support for various I/O standards, enhancing versatility for different applications.
Typical uses include consumer electronics, communication devices, and other embedded systems requiring efficient logic integration. The Spartan-3E series is valued for its affordability, making it a popular choice for prototyping and production in cost-effective projects.
Equivalent
Features
1. Logic Cells: Contains approximately 1.2 million system gates, providing versatile logic capabilities.
2. Configurable Logic Blocks (CLBs): Offers a large number of CLBs for implementing complex logic functions.
3. Memory: Equipped with distributed RAM and Block RAM for efficient memory storage.
4. I/O Blocks: Includes multiple I/O pins with support for various I/O standards like LVTTL and LVCMOS.
5. Clock Management: Features Digital Clock Managers (DCMs) for flexible clocking and timing solutions.
6. Performance: Operates at a speed grade of -4, which indicates moderate performance within the Spartan-3E range.
7. Package: Comes in a FTG256 package, which is a fine-pitch thin BGA, providing compactness.
8. Power Management: Designed with low power consumption in mind to suit cost-sensitive applications.
This FPGA is ideal for consumer electronics, industrial systems, and communication applications.
Pinout
The primary functions of the pins on this FPGA include:
1. User I/O Pins: Many of the pins are dedicated to input/output functionalities, allowing the FPGA to interface with other devices and systems.
2. Power Supply Pins: These pins provide the necessary power and ground connections required for the FPGA’s operation.
3. Configuration Pins: Used for configuring the FPGA at startup, these pins can support different programming methods such as JTAG or bitstream loading.
4. Clock Pins: Dedicated pins for clock inputs which are essential for synchronous operations within the FPGA.
5. Dedicated Pins: Some pins are allocated for specific functions like reset or mode selection.
This combination of pins enables the XC3S1200E-4FTG256C to be versatile and adaptable for multiple design and application requirements.
Manufacturer
Xilinx, founded in 1984 and headquartered in San Jose, California, is a pioneer in the field of programmable logic devices. The company is recognized for its innovation in the semiconductor industry, particularly for inventing the first commercially viable FPGA, which allows for hardware logic to be programmed or "reprogrammed" by the user. This flexibility is advantageous for prototyping, custom hardware solutions, and applications requiring rapid iteration and adaptability.
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), further expanding its reach and capabilities in the semiconductor industry. Today, Xilinx continues to be a key player in the development of FPGAs, providing solutions for a broad range of industries, including aerospace, automotive, communications, and data centers.