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XC3S1600E-4FGG320I
+Lista de MateriaisIC FPGA 250 I/O 320FBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC3S1600E-4FGG320I
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Pacote BGA-320
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Em Estoque2169
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-3E |
| Part Status | Active |
| Number of LABs/CLBs | 3688 |
| Number of Logic Elements/Cells | 33192 |
| Total RAM Bits | 663552 |
| Number of I/O | 250 |
| Number of Gates | 1600000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Features
- 1.6M system gates (33,792 logic cells).
- 320-pin Fine-Pitch BGA (FGG320) package.
- 4ns pin-to-pin delays (speed grade -4).
- 216Kb block RAM (36 x 6Kb blocks).
- 16 DSP slices for arithmetic operations.
- 231 user I/O pins (supports LVCMOS, LVTTL, HSTL, and SSTL).
- 1.2V core voltage, 3.3V/2.5V I/O banks.
- Digital Clock Managers (DCMs) for clock conditioning.
- On-chip oscillator for configuration.
- Low-cost, high-performance FPGA for embedded applications.
Ideal for consumer electronics, industrial control, and communications.
Application
1. Embedded Systems – For control and interfacing.
2. Communications – Signal processing, networking.
3. Industrial Automation – Motor control, sensor interfacing.
4. Consumer Electronics – Display controllers, multimedia.
5. Military/Aerospace – Rugged, reliable applications.
6. Prototyping & Education – Low-cost FPGA development.
Its 1.6M system gates, 320-pin BGA package, and low power make it suitable for cost-sensitive, mid-complexity designs.
