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XC3S2000-4FGG456C
+Lista de MateriaisIC FPGA 333 I/O 456FBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC3S2000-4FGG456C
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Pacote FBGA-456
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5120 |
| NumberofLogicElements/Cells | 46080 |
| TotalRAMBits | 737280 |
| NumberofI/O | 333 |
| NumberofGates | 2000000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 456-BBGA |
Visão Geral
Description
The key features of the XC3S2000-4FGG456C include:
1. Logic Capacity: It provides a gate count of approximately 2 million system gates.
2. Package: The FGG456 package features 456 pins, which facilitate connectivity and interfacing with other components.
3. Speed Grade: The "-4" in the part number indicates its speed grade, which affects the performance and timing characteristics of the FPGA.
4. IO Blocks: It supports multiple I/O standards and features a significant number of configurable I/O blocks.
5. Embedded Resources: The FPGA includes embedded multipliers, block RAM, and distributed RAM to enhance performance for specific tasks.
Overall, this FPGA is designed to meet the demands of complex applications requiring configurable digital logic.
Equivalent
1. Altera Cyclone II series, such as the EP2C35.
2. Lattice ECP2 series, like the LFE2-35.
3. Microsemi (formerly Actel) ProASIC3 series, such as the A3P1000.
These alternatives offer similar logic capacity and functionality. Always verify specific requirements like I/O count, power consumption, and package type for compatibility.
Features
1. Logic Cells: Approximately 2 million system gates with 46,080 logic cells.
2. Configuration: Configurable via JTAG and other standard interfaces.
3. I/O Pins: Offers 329 user I/O pins, with support for various I/O standards like LVCMOS, LVTTL, and HSTL.
4. Speed Grade: The "-4" denotes a specific speed grade, indicating performance characteristics.
5. Package: Comes in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package.
6. Embedded Multipliers: Contains dedicated hardware multipliers for DSP applications.
7. Block RAM: Features 720 Kbits of Block RAM for data storage.
8. Power Management: Optimized for low power consumption.
9. Clock Management: Includes Digital Clock Managers for precise clock frequency synthesis.
These features make it suitable for a variety of applications, including consumer electronics, automotive, data processing, and telecommunications.
Pinout
Key functions include:
- Logic Gates: For implementing custom digital logic.
- I/O Blocks: Support for various I/O standards.
- DCM Blocks: Digital Clock Manager blocks for clock signal management.
- RAM Blocks: Dedicated blocks for memory applications.
- Multipliers: For efficient arithmetic operations.
- Configurable Logic Blocks (CLBs): Provide the logic resources to implement combinational and sequential logic.
- Embedded Multipliers: Enhance processing capabilities for DSP applications.
Overall, the XC3S2000-4FGG456C is suitable for a variety of applications including telecommunications, consumer electronics, and automotive systems where flexibility and performance are required at a lower cost.