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XC3S200AN-4FT256I
+Lista de MateriaisIC FPGA 195 I/O 256FTBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC3S200AN-4FT256I
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Pacote BGA-256
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Em Estoque6088
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-3AN |
| Part Status | Active |
| Number of LABs/CLBs | 448 |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of I/O | 195 |
| Number of Gates | 200000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The device includes integrated Flash memory, which provides the advantage of storing configuration data and user data, making it ideal for applications requiring non-volatile storage. This feature simplifies the design process by eliminating the need for external configuration memory.
Main features include a rich set of I/O standards, low power consumption, and support for various interfaces, making it suitable for applications in consumer electronics, automotive, and industrial fields. With its cost-effectiveness and flexibility, the XC3S200AN-4FT256I is a robust choice for designers needing a balance of performance and non-volatile capabilities in FPGA applications.
Equivalent
Features
1. Logic Cells: It contains 200,000 system gates.
2. I/O Pins: Offers up to 195 user I/O pins, depending on the package.
3. Package: Comes in a 256-ball FTBGGA package.
4. Embedded Memory: Includes 360 Kbits of fast block RAM.
5. Non-Volatile Storage: Integrates 1.8 Mb of SPI Flash memory for configuration and data storage.
6. Performance: Rated for -4 speed grade, suitable for industrial temperature range (-40°C to +100°C).
7. Low Power: Designed for low power consumption.
8. Configuration: Supports in-system programmability and multi-boot capability.
9. Clock Management: Features four digital clock managers (DCMs) for improved clock management and distribution.
10. Advanced I/O Support: Compatible with various I/O standards, including LVCMOS, LVTTL, PCI, and more.
11. JTAG Support: Features JTAG boundary-scan support for easier testing and debugging.
These features make the XC3S200AN-4FT256I suitable for diverse applications requiring robust programmable logic solutions.
Pinout
The device features 200,000 system gates and includes a range of I/O options and internal resources suitable for various digital logic designs. It supports a broad array of I/O standards, including LVCMOS, LVTTL, and differential standards like LVDS. The FPGA also includes embedded memory blocks, digital clock managers (DCMs), and distributed RAM, which can be configured for different logic and memory functions.
Its non-volatile configuration memory is integrated into the FPGA, enabling a single-chip solution that simplifies design and reduces system costs. This makes it ideal for applications requiring reliable, low-power, and cost-effective programmable logic solutions.
Manufacturer
Application
1. Embedded Systems: Ideal for microcontroller and DSP co-processing.
2. Communication Systems: Suitable for implementing custom protocols and signal processing.
3. Industrial Automation: Used in control systems and robotics for flexible processing.
4. Consumer Electronics: Supports multimedia and interface bridging.
5. Automotive: Utilized for infotainment systems and advanced driver-assistance systems (ADAS).
6. Data Acquisition: Excellent for processing and managing data streams in instrumentation.
These applications leverage the FPGA's reconfigurability, cost-effectiveness, and integrated features.