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XC3S500E-4FTG256C
+Lista de MateriaisIC FPGA 190 I/O 256FTBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC3S500E-4FTG256C
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Pacote BGA-256
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Em Estoque4036
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1164 |
| NumberofLogicElements/Cells | 10476 |
| TotalRAMBits | 368640 |
| NumberofI/O | 190 |
| NumberofGates | 500000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Visão Geral
Description
The "-4" denotes the speed grade, indicating moderate performance characteristics. This FPGA is equipped with ample I/O options, embedded multipliers, and up to 360 Kbits of block RAM, facilitating complex data processing tasks. Its architecture supports a variety of design tools, enabling flexibility and scalability in design implementation.
The Spartan-3E series also includes features like Digital Clock Managers (DCMs) for clock synthesis and dynamic phase shifting, enhancing the device's capability to handle diverse timing requirements. As a low-cost solution, it is ideal for budget-conscious projects requiring reliable performance and flexibility in programmable logic.
Equivalent
Features
1. Logic Resources: It contains 500,000 system gates and 9,312 logic cells, organized in a 1,536 slice architecture.
2. I/Os and Package: It offers 190 user I/O pins and comes in a 256-ball Fine-Pitch Ball Grid Array (FTBGA) package.
3. Memory: It has 360 Kbits of block RAM integrated on-chip.
4. DSP Capabilities: Includes 20 dedicated 18x18 hardware multipliers for efficient DSP operations.
5. Clock Management: Features four Digital Clock Managers (DCMs) for precise clock management and synthesis.
6. Speed Grade: The "-4" indicates a specific speed grade, impacting timing performance.
7. Power: Designed for low power consumption, suitable for battery-powered applications.
8. Configuration: Supports various configuration modes including JTAG, Slave Serial, and Master Serial/SPI.
These features make the XC3S500E-4FTG256C suitable for diverse applications, including consumer electronics, industrial automation, and communication systems.
Pinout
Key features of the XC3S500E-4FTG256C include:
1. Logic Cells: Approximately 500,000 system gates.
2. I/O Pins: It supports up to 190 I/O pins, configurable for various I/O standards.
3. RAM Blocks: Up to 360 Kbits of block RAM.
4. Clock Management: Includes Digital Clock Managers (DCMs) for clock signal generation and management.
5. Configurable Logic Blocks (CLBs): Provide the main logic resources for implementing custom logic.
6. Connectivity: Supports multiple I/O standards, including LVTTL, LVCMOS, and more.
This FPGA is suitable for applications requiring moderate complexity with cost-effective solutions, often used in consumer electronics, telecommunications, and automotive systems.
Manufacturer
Application
1. Consumer Electronics: Implementing custom logic in devices like TVs and set-top boxes.
2. Communications: Supporting protocols in networking equipment, modems, and wireless infrastructure.
3. Automotive: Enabling advanced features in infotainment systems and driver assistance.
4. Industrial Automation: Managing control systems and interfacing with sensors and actuators.
5. Medical Devices: Providing flexibility and customization in diagnostic and monitoring equipment.
6. Embedded Systems: As a reconfigurable processor in various custom applications for prototyping or final products.