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XC3SD1800A-4CSG484I
+Lista de MateriaisIC FPGA 309 I/O 484CSBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC3SD1800A-4CSG484I
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Pacote CSBGA-484
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Em Estoque5270
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-3A DSP |
| Part Status | Active |
| Number of LABs/CLBs | 4160 |
| Number of Logic Elements/Cells | 37440 |
| Total RAM Bits | 1548288 |
| Number of I/O | 309 |
| Number of Gates | 1800000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features include:
1. Logic Cells and Slices: It contains a considerable number of logic cells, organized into slices, which are programmable to implement complex logic designs.
2. DSP Blocks: It is equipped with dedicated DSP blocks to handle arithmetic operations efficiently, crucial for signal processing tasks.
3. Memory: The device offers embedded RAM blocks for on-chip data storage, facilitating faster data access and processing.
4. I/O Capabilities: The device supports a variety of I/O standards and configurations, providing flexibility in interfacing with other system components.
5. Package: The CSG484 package type denotes a 484-pin ball grid array configuration, offering a compact and robust physical form factor.
The XC3SD1800A-4CSG484I is ideal for cost-sensitive DSP applications such as wireless communication, video processing, and industrial automation.
Equivalent
Features
1. Logic Cells: It contains 37,440 logic cells, which facilitate complex designs and high-performance computing tasks.
2. I/O Pins: The device offers 309 user I/O pins, providing extensive connectivity options for various applications.
3. DSP Slices: It features 84 DSP slices, enhancing digital signal processing capabilities, ideal for applications requiring heavy computations.
4. Block RAM: It includes 1,872 Kbits of block RAM for robust data storage and retrieval.
5. Package: The FPGA is housed in a 484-pin Fine-pitch Ball Grid Array (FBGA) package, suitable for compact and efficient designs.
6. Temperature Range: Designed for industrial applications, it operates efficiently in a range of -40°C to +100°C.
7. Speed Grade: The '-4' speed grade denotes its operational performance level, balancing power and speed.
8. Power Management: The device is optimized for low power consumption, making it suitable for energy-efficient designs.
These features make the XC3SD1800A-4CSG484I a versatile choice for applications in communications, automotive, consumer electronics, and industrial sectors.
Pinout
Key functions and features include:
1. Logic Cells: Contains a significant number of logic cells that can be configured for various digital circuit designs.
2. DSP Slices: Integrated DSP slices optimized for high-speed arithmetic operations.
3. Block RAM: Offers embedded memory blocks for data storage and buffering.
4. I/O Options: Supports a variety of I/O standards for flexible interfacing with other components.
5. Clock Management: Includes Digital Clock Managers (DCMs) for precision clock management.
This FPGA is ideal for applications that require a combination of processing power and flexibility, such as communications, automotive, and industrial control systems.
Manufacturer
Application
1. Telecommunications: Used in baseband processing, modems, and wireless communication systems.
2. Industrial Automation: Supports control systems, motor control, and robotics.
3. Consumer Electronics: Applicable in audio/video processing and digital television.
4. Automotive Systems: Utilized in infotainment systems and advanced driver assistance systems (ADAS).
5. Medical Devices: Supports imaging and diagnostic equipment through real-time data processing.
6. Aerospace and Defense: Used in tactical communication systems and radar processing.
These applications benefit from the device's DSP capabilities, low power consumption, and cost-effectiveness.