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XC5VFX130T-1FF1738I
+Lista de MateriaisIC FPGA 840 I/O 1738FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC5VFX130T-1FF1738I
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Pacote FCBGA-1738
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Em Estoque1729
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Virtex®-5 FXT |
| ProductStatus | Active |
| NumberofLABs/CLBs | 10240 |
| NumberofLogicElements/Cells | 131072 |
| TotalRAMBits | 10985472 |
| NumberofI/O | 840 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1738-BBGA, FCBGA |
Visão Geral
Description
The device is housed in a fine-pitch 1738-ball flip-chip package (FF1738) and operates at an industrial temperature range, indicated by the 'I' suffix. It integrates several key components, including PowerPC processors, DSP slices, and high-speed serial connectivity options, which enhance its computational and data handling capabilities.
The "-1" speed grade signifies its operating frequency, which determines the balance between performance and power consumption. This FPGA is ideal for applications requiring a combination of flexibility, performance, and reliable operation in varied environmental conditions. Its comprehensive tool support, coupled with Xilinx's development ecosystem, provides a seamless design and deployment experience for engineers.
Equivalent
1. Intel (formerly Altera) Stratix III or Stratix IV series.
2. Lattice Semiconductor’s ECP3 series.
3. Microsemi (formerly Actel) SmartFusion2 or ProASIC3 series.
These equivalents may vary based on specific requirements like logic density, power consumption, and feature set. Always compare datasheets for precise matching.
Features
1. Logic Resources: It offers approximately 130,000 logic cells, providing substantial flexibility for complex designs.
2. DSP Slices: The FPGA includes 320 DSP48E slices, which are optimized for high-speed digital signal processing tasks.
3. Embedded PowerPC Processor: It features an embedded PowerPC 440 processor, enabling effective handling of embedded processing tasks.
4. Memory: The device contains abundant block RAM providing a total of about 10,332 Kbits for efficient data storage and access.
5. I/O and Connectivity: It supports a wide range of I/O standards and includes 24 RocketIO GTP/GTX transceivers for high-speed serial connectivity.
6. Clock Management: Equipped with multiple DCMs (Digital Clock Managers) and PLLs (Phase-Locked Loops) for precise clock management and distribution.
7. Packaging: The device is available in an FF1738 package, which is a ball grid array format.
8. Temperature Range: Rated for industrial temperatures, making it suitable for harsh environments.
These features make it ideal for applications requiring high performance and reliability, such as communications, aerospace, and defense systems.
Pinout
Key features of the XC5VFX130T include:
- 17,280 logic slices
- 192 DSP48E slices for digital signal processing
- 822,720 kilobits of block RAM
- Multi-gigabit transceivers for high-speed serial connectivity
- Embedded PowerPC 440 processor blocks
- Configurable I/O standards and interfaces
These features make the XC5VFX130T suitable for applications in telecommunications, video processing, and other fields requiring significant computational resources and high-speed data handling capabilities.
Manufacturer
Application
1. Digital Signal Processing (DSP): Handling complex mathematical computations for audio, video, and communications processing.
2. Embedded Processing: Implementing custom processors and handling data-intensive tasks in embedded systems.
3. Communications: Supporting high-speed data transfer and protocol implementation in networking and telecommunications.
4. Aerospace and Defense: Used in radar, sonar, and secure communications due to its reconfigurability and reliability.
5. Industrial Automation: Facilitating real-time control and monitoring systems in manufacturing and automation.
These applications benefit from the device's high logic density, DSP slices, and embedded processing capabilities.