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XC5VFX70T-2FFG1136I
+Lista de MateriaisIC FPGA 640 I/O 1136FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC5VFX70T-2FFG1136I
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Pacote BGA-1136
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Em Estoque3311
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Virtex®-5 FXT |
| Part Status | Active |
| Number of LABs/CLBs | 5600 |
| Number of Logic Elements/Cells | 71680 |
| Total RAM Bits | 5455872 |
| Number of I/O | 640 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features of the XC5VFX70T include a high logic capacity with around 70,000 logic cells and integrated PowerPC processor blocks for enhanced processing capabilities. It supports extensive DSP functionality, making it suitable for signal processing applications. Furthermore, it offers significant I/O flexibility and bandwidth, crucial for complex data handling tasks. The device is also equipped with low-power consumption features and supports partial reconfiguration, which allows for real-time hardware updates without halting system operations. Overall, the XC5VFX70T-2FFG1136I is a versatile FPGA ideal for demanding, high-speed applications.
Equivalent
Features
The FPGA supports a wide range of I/O standards, with 640 I/O pins and high-speed serial connectivity via up to 16 RocketIO GTP transceivers, operating at data rates up to 3.75 Gbps. It offers advanced clock management with multiple Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs) for precision timing and synchronization.
The device comes in a 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package and is designed for industrial-grade applications, with an operating temperature range from -40°C to +100°C. It provides powerful capabilities for complex computations, making it suitable for applications like telecommunications, video processing, and high-speed data transmission.
Pinout
1. Logic Resources: It includes a significant number of Configurable Logic Blocks (CLBs) which contain slices for implementing combinational and sequential logic.
2. DSP Capabilities: It features DSP48E slices, which are specialized for high-performance signal processing tasks.
3. Memory: The FPGA contains Block RAMs for on-chip data storage and FIFOs, providing flexibility in design implementation.
4. I/O Options: It supports a wide range of I/O standards and includes high-speed serial transceivers.
5. Embedded Processing: The FX version includes embedded PowerPC 440 cores suitable for embedded processing applications.
6. Connectivity: It provides options for Ethernet, PCI Express, and other high-speed communication protocols.
7. Development: Suitable for complex applications in communications, automotive, and aerospace.
In summary, the XC5VFX70T-2FFG1136I offers extensive logic, DSP, memory, and embedded processing capabilities in an 1136-pin package designed for demanding applications.
Manufacturer
Application
1. Telecommunications: Used in networking equipment for high-speed data processing.
2. Broadcasting: Supports video processing and encoding.
3. Aerospace and Defense: Provides robust solutions for signal processing and radar systems.
4. Medical Imaging: Facilitates high-speed imaging data processing.
5. High-Performance Computing: Used in data centers for acceleration tasks.
6. Automotive: Supports advanced driver-assistance systems (ADAS).
Its high logic density, DSP slices, and integrated PowerPC cores make it suitable for demanding applications requiring intensive computations and real-time processing.