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XC5VLX50-1FFG324I
+Lista de MateriaisIC FPGA 220 I/O 324FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC5VLX50-1FFG324I
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Pacote FCBGA-324
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Virtex®-5 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3600 |
| NumberofLogicElements/Cells | 46080 |
| TotalRAMBits | 1769472 |
| NumberofI/O | 220 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-BBGA, FCBGA |
Visão Geral
Description
1. Device Family: Virtex-5, which is renowned for delivering high-speed connectivity, robust processing power, and a versatile logic platform suited for a range of applications from communications to consumer electronics.
2. Logic Cells: The "LX50" part suggests it contains approximately 50,000 logic cells, making it suitable for moderately complex designs.
3. Speed Grade: The "-1" denotes the speed grade, with lower numbers generally indicating slower speeds compared to higher-speed grades within the same family.
4. Package: "FFG324" specifies the package type and pin count, indicating it’s a Fine-Pitch Ball Grid Array with 324 pins. This package type supports efficient integration into complex circuit boards.
5. Temperature Range: The "I" suffix indicates that the device operates within the industrial temperature range, suitable for environments that require rigorous thermal reliability.
Overall, the XC5VLX50-1FFG324I is ideal for projects demanding moderate logic density and reliable performance across various operating conditions.
Equivalent
Features
1. Logic Resources: Approximately 50,000 logic cells, offering significant flexibility for implementing complex designs.
2. Configurable Logic Blocks (CLBs): Advanced CLBs with 6-input LUTs for efficient logic synthesis.
3. I/O Capabilities: Supports numerous high-speed I/O standards, including LVDS, with a total of 200 user I/Os.
4. Memory: Includes large Block RAMs, with around 1728 Kbits of distributed memory and 1.728 MB of Block RAM.
5. DSP Slices: Comprises dedicated DSP48E slices for high-performance signal processing tasks.
6. Clock Management: Features advanced clock management with multiple DCMs and PLLs for flexible clock generation and management.
7. Power Efficiency: Designed for optimized power consumption with features like reduced static power.
8. Temperature Range: Industrial grade, suitable for -40°C to 100°C, making it ideal for harsh environments.
9. Package: FFG324 package, a fine-pitch BGA form factor for enhanced connectivity.
This FPGA is well-suited for applications requiring high performance, flexibility, and robust I/O capabilities.
Manufacturer
Xilinx's products are utilized across a wide range of industries, including telecommunications, automotive, aerospace, defense, and consumer electronics, enabling advanced computing and processing capabilities. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), another major player in the semiconductor industry, which expanded AMD's portfolio into adaptive computing, complementing its existing CPU and GPU offerings. Xilinx continues to operate as part of AMD, contributing to advancements in FPGA technology and adaptive computing solutions.
Application
1. Telecommunications: For signal processing and data transmission.
2. Networking: In routers and switches to handle high-speed data operations.
3. Aerospace and Defense: For radar systems, avionics, and secure communications.
4. Broadcast and Video: To manage video processing and encoding tasks.
5. Industrial Automation: For control systems and real-time processing.
6. Medical Imaging: Supporting high-speed data acquisition and processing.
These applications benefit from the FPGA's reconfigurability, parallel processing capabilities, and ability to handle complex algorithms.