XC5VSX95T-1FF1136I

XC5VSX95T-1FF1136I is a Xilinx Virtex-5 SX FPGA. Quick intro:
- Family and device: Virtex-5 SX device (high-density FPGA for DSP and high-speed I/O).
- Capacity: ~95k logic cells, plus on-chip RAM blocks and DSP resources.
- I/O and transceivers: flexible I/O banks with high-speed serial capabilities (RocketIO/GT-like), suitable for multi-gigabit links.
- Clocking: multiple PLLs/MMCMs for complex, synchronized clocking.
- Package: FF1136I—a 1136-ball flip-chip BGA, industrial temperature range (-40 to 85 °C).
- Speed grade: -1 (fastest standard option for this device).
- Tooling: designed with Xilinx ISE/Vivado toolchains (ISE era for Virtex-5).
- Typical uses: DSP, video processing, telecommunications, embedded data-processing, and other high-throughput applications.
- Note: Virtex-5 is an older family; for new designs you might consider newer Xilinx families for improved performance and power efficiency.

XC5VSX95T-1FF1136I is a Virtex-5 SX family FPGA.
Key features (high level):
- About 95K logic cells (high-density SX device)
- Embedded DSP resources for fast mathematical Compute
- On-chip Block RAM plus distributed RAM
- High-speed serial capabilities (RocketIO/GTP-style transceivers) for protocol interconnects
- Clock management with PLLs (and DCMs) for flexible timing
- Multiple I/O banks with substantial I/O count in the FF1136 package
- Industrial temperature range (-40 to 100°C)
- 1136-ball flip-chip BGA package (FF1136)
Notes: exact resource counts (BRAM, DSP slices, I/O, transceiver speeds) vary by device revisions and packaging. For precise specifications, consult the latest Xilinx datasheet and user guide.

- Pin count: 1136 pins (FF1136 package)
- Function: Xilinx Virtex-5 SX FPGA (XC5VSX95T) with ~95K logic cells (industrial temperature, speed grade -1)

Manufacturer: Xilinx, Inc. (now part of AMD).
What kind of company: A semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (e.g., Virtex/V5), along with CPLDs and SoCs.

Typical application areas for XC5VSX95T-1FF1136I:
- High-end communications and baseband processing (RF transceivers, wireless infrastructure, protocol processing)
- DSP-intensive signal processing (radar/sonar, software-defined radio, multimedia acceleration)
- Video and image processing (HD video pipelines, encoding/decoding, image analytics)
- Networking and data-center acceleration (packet processing, switching, hardware offload)
- Embedded processing and control (industrial automation, automotive, medical imaging, instrumentation)
These FPGA fabric, DSP slices, and high-speed I/O make it suitable for projects requiring large logic density and flexible, reconfigurable accelerators.

FF1136 – a Flip-Chip Ball Grid Array (1136-ball) package, industrial temperature range (-40°C to +85°C).