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XC6SLX100-2FGG676C
+Lista de MateriaisIC FPGA 480 I/O 676FBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC6SLX100-2FGG676C
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Pacote FBGA-676
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 7911 |
| Number of Logic Elements/Cells | 101261 |
| Total RAM Bits | 4939776 |
| Number of I/O | 480 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
- Logic Capacity: 101,261 logic cells, suitable for complex designs.
- Package: 676-pin Fine-Pitch Ball Grid Array (FBGA), offering high I/O density.
- Speed Grade: -2, indicating moderate performance (higher numbers are slower).
- Power Efficiency: Built on 45nm low-power CMOS technology.
- I/O Support: Supports multiple standards (LVCMOS, LVDS, etc.) with up to 487 user I/Os.
- On-Chip Resources: Includes DSP slices, block RAM (4.8 Mb), and clock management (DCM, PLL).
Applications: Embedded systems, industrial control, automotive, and consumer electronics.
Note: Part of the now-mature Spartan-6 series, it remains popular for legacy designs but is not recommended for new projects (consider newer Artix-7 or Spartan-7 FPGAs).
Equivalent
- Lattice ECP5 (e.g., LFE5UM-85F-8BG381C)
- Intel (Altera) Cyclone IV (e.g., EP4CE115F29C7N)
- Microsemi (Microchip) SmartFusion2 (e.g., M2S090-FGG484)
These alternatives offer similar logic capacity, power efficiency, and I/O options. For exact replacements, verify specs like speed grade, package, and features.
Pinout
- Pin count: 676 (FGG676 package)
- Key functions:
- Logic cells: 101,261
- DSP slices: 180
- Block RAM: 4,824 Kb
- I/O pins: Up to 396 (supports LVCMOS, LVDS, etc.)
- Clock management: 6 DCMs & 4 PLLs
- Transceivers: None (base Spartan-6 model).
It operates at -2 speed grade (moderate performance) and is suited for cost-sensitive, mid-range applications.
Application
- Embedded Systems – Industrial control, automation.
- Communications – Networking, baseband processing.
- Medical Devices – Imaging, diagnostic equipment.
- Aerospace & Defense – Avionics, radar, secure comms.
- Consumer Electronics – HD video, gaming.
- Automotive – ADAS, infotainment.
Its low power, high logic density (101K logic cells), and 676-pin BGA package make it ideal for cost-sensitive, high-performance applications.