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XC6SLX150-2CSG484I
+Lista de MateriaisIC FPGA 338 I/O 484CSBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC6SLX150-2CSG484I
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Pacote BGA-484
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 11519 |
| Number of Logic Elements/Cells | 147443 |
| Total RAM Bits | 4939776 |
| Number of I/O | 338 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The "-2" speed grade indicates a moderate performance level within the Spartan-6 lineup. The "CSG484" denotes its package type, with a 484-pin grid array, which supports efficient heat dissipation and compact design. The "I" suffix signifies an industrial temperature range, meaning it operates reliably between -40°C and 100°C, suitable for demanding environments.
Spartan-6 FPGAs support advanced development with tools like Xilinx ISE Design Suite, and they provide features such as integrated memory controllers, DSP slices, and efficient power management. These characteristics make the XC6SLX150-2CSG484I an optimal choice for designers seeking a balance of flexibility, performance, and cost-effectiveness in programmable logic solutions.
Equivalent
Features
1. Logic Resources: It contains approximately 147,443 logic cells, offering substantial computational capability for various applications.
2. Memory: Equipped with 4,836 Kbits of block RAM, providing sufficient on-chip storage for data processing.
3. DSP Slices: Contains 180 DSP slices, optimizing it for digital signal processing tasks.
4. I/O Options: Supports multiple I/O standards with up to 338 I/O pins, facilitating extensive connectivity.
5. Clock Management: Comes with 6 clock management tiles (CMTs), each comprising a phase-locked loop (PLL) and two digital clock managers (DCMs) to ensure robust clocking for various designs.
6. Temperature Rating: The "-2" speed grade denotes a moderate performance level, while the "I" indicates industrial-grade temperature range support (-40°C to 100°C).
7. Package: The CSG484 package is a ball grid array (BGA) type, providing a compact and reliable physical form factor.
These features make the XC6SLX150-2CSG484I versatile for applications in industrial, automotive, and communication systems.
Pinout
Key functions of the XC6SLX150-2CSG484I include:
1. Logic Resources: The FPGA has a large number of configurable logic blocks (CLBs) that can be programmed to perform complex combinational and sequential logic operations.
2. I/O Functions: It supports numerous I/O standards and includes a variety of I/O banks to facilitate interfacing with different voltages and standards.
3. Memory: The device features block RAM and distributed RAM for efficient data storage and retrieval.
4. DSP Slices: It includes DSP slices for high-performance arithmetic and signal processing tasks.
5. Clock Management: Integrated clock management tiles (CMTs) support various clocking features including PLLs and DLLs for precise clock signal management.
6. Power Management: The FPGA is designed with power-saving modes and features to optimize energy consumption.
Overall, the XC6SLX150-2CSG484I is a versatile FPGA suitable for a broad range of applications.
Manufacturer
Xilinx's products are used in a wide range of applications, including telecommunications, automotive, consumer electronics, aerospace, and defense. In recent years, Xilinx has focused on expanding its offerings in adaptive computing, including artificial intelligence and machine learning applications. In 2020, the company was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry known for its CPUs and GPUs. This acquisition was completed in 2022, positioning Xilinx as a key part of AMD’s broader strategy to enhance its capabilities in both high-performance computing and adaptive systems.