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XC6SLX150-3CSG484I
+Lista de MateriaisIC FPGA 338 I/O 484CSBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC6SLX150-3CSG484I
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Pacote BGA-484
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Em Estoque7259
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 11519 |
| Number of Logic Elements/Cells | 147443 |
| Total RAM Bits | 4939776 |
| Number of I/O | 338 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The FPGA operates with a -3 speed grade, providing faster performance compared to lower speed grades. The "I" at the end signifies that this model is designed for industrial temperature ranges, enhancing its reliability in challenging environments. Spartan-6 FPGAs are known for their optimized logic and routing capabilities, DSP slices, and integrated memory, supporting high-speed connectivity and advanced processing.
These features make the XC6SLX150-3CSG484I suitable for applications like embedded processing, communication systems, and advanced signal processing. Additionally, its compatibility with Xilinx's ISE Design Suite ensures a streamlined development process, facilitating rapid deployment and flexible design implementations.
Equivalent
Features
1. Logic Cells: It contains approximately 147,443 logic cells, suitable for various applications requiring moderate complexity.
2. Configurable Logic Blocks (CLBs): These are utilized for implementing custom logic designs.
3. Digital Signal Processing (DSP) Slices: It has 180 DSP slices, beneficial for high-speed signal processing tasks.
4. Block RAM: It includes 4.8 Mb of block RAM, supporting efficient data storage and retrieval.
5. I/O Pins: The device has 338 I/O pins, offering extensive connectivity options.
6. Speed Grade: The "-3" indicates a higher speed grade, suitable for applications requiring faster processing.
7. Operating Temperature: The "I" specifies industrial-grade, indicating it operates efficiently between -40°C to 100°C.
8. Package Type: The CSG484 package is a compact, ball-grid array (BGA) design, facilitating efficient board space utilization.
These features make the XC6SLX150-3CSG484I versatile for applications in industrial, automotive, and communications sectors.
Pinout
Key functions and features include:
1. Logic Resources: It has a large number of configurable logic blocks (CLBs) to implement complex digital circuits.
2. DSP Slices: Equipped with DSP slices for efficient signal processing operations.
3. Memory: Contains embedded block RAM for data storage and processing.
4. I/O Flexibility: Supports a variety of I/O standards, making it adaptable for different interface requirements.
5. Clock Management: Includes advanced clock management tiles for precise timing and clock distribution.
6. Power Efficiency: Designed for low power consumption while maintaining performance.
7. Configuration Options: Supports multiple configuration modes, enabling easy updates and reprogramming.
This combination of features makes the XC6SLX150-3CSG484I suitable for applications in areas like telecommunications, consumer electronics, automotive, and industrial automation.
Manufacturer
Application
1. Telecommunications: For signal processing and protocol implementation.
2. Industrial Control Systems: Used in automation and control applications.
3. Consumer Electronics: In devices requiring custom processing capabilities.
4. Medical Equipment: For imaging and diagnostic equipment.
5. Automotive Systems: In advanced driver-assistance systems (ADAS) and infotainment.
6. Networking: Used for data packet processing and network acceleration.
7. Aerospace and Defense: Employed in systems requiring reliability and real-time processing.
These applications benefit from the FPGA's high logic density and I/O capabilities.