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XC6SLX25-2FGG484C
+Lista de MateriaisIC FPGA 266 I/O 484FBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC6SLX25-2FGG484C
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Pacote FCBGA-484
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Em Estoque2670
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 1879 |
| Number of Logic Elements/Cells | 24051 |
| Total RAM Bits | 958464 |
| Number of I/O | 266 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
Key features of the XC6SLX25-2FGG484C include:
1. Logic Cells: It contains 24,051 logic cells, making it suitable for moderate complexity designs.
2. Package: Comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package, facilitating compact designs.
3. Performance Grade: The "-2" indicates its performance grade, determining its speed and power characteristics.
4. Cost-Effectiveness: Offers a balance between performance and cost, ideal for budget-sensitive projects.
5. Low-Power Consumption: Designed with power efficiency in mind, beneficial for battery-operated devices.
6. I/O Capabilities: Supports a wide range of I/O standards, providing flexibility in interfacing with other components.
Overall, the XC6SLX25-2FGG484C is valued for its versatility, making it a popular choice for developers seeking a reliable and efficient FPGA solution.
Equivalent
1. Intel (Altera) Cyclone IV FPGA series.
2. Lattice ECP3 series.
3. Microsemi SmartFusion2 series.
These alternatives might offer similar logic density and I/O capabilities but differences in architecture, power consumption, and toolchain support should be considered. Always verify specific requirements and compatibility with your project needs.
Features
1. Logic Cells: Approximately 24,051 logic cells for versatile design implementations.
2. Configurable Logic Blocks (CLBs): Contains slices with 6-input LUTs for efficient logic resource utilization.
3. Memory: 936 Kbits of block RAM for data storage and processing.
4. DSP Slices: 38 DSP slices, optimizing digital signal processing tasks.
5. Clock Management: Includes four clock management tiles (CMTs), each with a phase-locked loop (PLL) and two digital clock managers (DCMs).
6. I/O Pins: 338 user I/O pins, adaptable for various interfaces and connectivity.
7. Connectivity Support: Supports multiple standards like LVTTL, LVCMOS, PCI, and SSTL.
8. Power Efficiency: Designed for low power consumption with a 1.2V core voltage.
9. Package: Comes in a 484-ball fine-pitch Ball Grid Array (BGA) package.
These features make the XC6SLX25-2FGG484C suitable for cost-sensitive applications requiring moderate logic capacity and DSP capabilities, such as communications, automotive, and consumer electronics.
Pinout
Key functions and features of the XC6SLX25 include:
1. Logic Cells: It contains approximately 24,051 logic cells.
2. Memory: Offers a significant amount of distributed RAM and block RAM.
3. DSP Slices: Includes dedicated DSP slices for efficient signal processing tasks.
4. I/O and Connectivity: Supports a variety of I/O standards and includes support for LVDS, PCI, and more.
5. Clock Management: Features sophisticated clock management with PLLs and clock dividers.
6. Configuration Options: Supports multiple configuration modes, including JTAG and serial configuration.
These features make the XC6SLX25 suitable for implementing complex digital logic designs while maintaining efficient power consumption and performance.
Manufacturer
Application
1. Consumer Electronics: Used in devices like HDTVs and home networking systems for video processing and connectivity.
2. Automotive: Applied in infotainment systems, advanced driver-assistance systems (ADAS), and vehicle networking.
3. Telecommunications: Utilized in wireless infrastructure for signal and data processing.
4. Industrial Control: Employed in motor control, robotics, and industrial networking equipment.
5. Medical Devices: Integrated into imaging and patient monitoring systems.
These applications benefit from the FPGA's flexibility, low power consumption, and high processing capabilities.