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XC6SLX25-2FTG256C
+Lista de MateriaisIC FPGA 186 I/O 256FTBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC6SLX25-2FTG256C
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Pacote FBGA-256
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 1879 |
| Number of Logic Elements/Cells | 24051 |
| Total RAM Bits | 958464 |
| Number of I/O | 186 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
The "FTG256" part of its designation indicates the package type: a Fine-Pitch Ball Grid Array (FBGA) with 256 pins, which ensures a compact footprint for space-constrained designs. The "-2" speed grade signifies a mid-range performance level within the Spartan-6 family.
The Spartan-6 series offers advanced power management features, clock management with integrated phase-locked loops, and support for multiple I/O standards. This makes the XC6SLX25-2FTG256C ideal for cost-sensitive applications requiring reliable performance, such as consumer electronics, industrial automation, and communications equipment. It also supports Xilinx's development tools, facilitating efficient design and deployment.
Equivalent
1. Altera (Intel) Cyclone IV series, e.g., EP4CE22
2. Lattice Semiconductor’s iCE40 series, e.g., iCE40HX8K
3. Microsemi (Microchip) IGLOO2 or SmartFusion2 series, although these may not be direct pin-for-pin equivalents.
Keep in mind these alternatives might differ in terms of architecture, power consumption, and toolchain support. Always verify specific requirements and compatibility for your application.
Features
1. Logic Cells: Approximately 24,051 logic cells for versatile FPGA applications.
2. Slices: Contains 3,758 slices, with each slice comprising 4 LUTs and 8 flip-flops.
3. Block RAM: Offers 936 Kbits of available block RAM for data storage.
4. DSP Slices: Equipped with 38 DSP slices for efficient signal processing tasks.
5. I/O Pins: Supports up to 186 user I/O pins, enabling extensive connectivity options.
6. Low Power: Designed for low power consumption, making it suitable for portable and energy-efficient applications.
7. Speed Grade: The "-2" indicates a mid-range speed grade, balancing performance and power efficiency.
8. Package: Comes in a 256-ball Fine-Pitch Thin Ball Grid Array (FTG256) package.
9. Configuration: Supports multiple configuration options, including JTAG and SPI.
10. Built-in Features: Includes built-in hard IP cores, clock management tiles, and integrated memory controllers.
These features make it ideal for a range of applications from consumer electronics to industrial automation.
Pinout
The device is designed for a wide range of applications and offers the following functionalities:
1. Logic Cells: It contains approximately 24,051 logic cells, providing flexibility for implementing complex digital designs.
2. I/O Pins: It offers a rich set of configurable Input/Output pins for interfacing with various components and peripherals.
3. DSP Slices: It includes 38 dedicated DSP slices for efficient implementation of arithmetic operations.
4. Memory: The FPGA features 936 Kbits of block RAM for on-chip data storage.
5. Clock Management: It supports multiple clock management features, including Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs) for sophisticated clocking schemes.
6. Power Management: Designed for low power consumption suitable for a variety of embedded applications.
These characteristics make the XC6SLX25-2FTG256C suited for applications in communications, automotive, consumer electronics, and more.
Manufacturer
Xilinx was founded in 1984 and has played a significant role in the semiconductor industry by pioneering the development of programmable logic solutions that allow for rapid prototyping and deployment of digital systems. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a multinational company known for its processors and graphics technologies, further expanding its capabilities and market reach.
Application
1. Consumer Electronics: Enhances performance in devices like TVs and set-top boxes.
2. Industrial Automation: Used in robotics, motor control, and industrial networking.
3. Communications: Supports wireless infrastructure, networking equipment, and data processing.
4. Automotive: Applied in advanced driver-assistance systems (ADAS) and infotainment.
5. Medical Devices: Utilized in imaging and diagnostic equipment.
6. Aerospace and Defense: Deployed in communication systems and sensor processing.
Overall, it is valued for its flexibility and adaptability in a wide range of technologically demanding fields.