XC6SLX25-3CSG324C

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XC6SLX25-3CSG324C

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IC FPGA 226 I/O 324CSBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XC6SLX25-3CSG324C

  • Pacote 324-LFBGA

  • Em Estoque7746

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Especificações

Atributo Valor
Package Tray
Series Spartan®-6 LX
ProductStatus Active
NumberofLABs/CLBs 1879
NumberofLogicElements/Cells 24051
TotalRAMBits 958464
NumberofI/O 226
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 324-LFBGA, CSPBGA

Visão Geral

Description

The XC6SLX25-3CSG324C is a member of the Xilinx Spartan-6 FPGA family. Designed for cost-sensitive applications, it offers a balance between performance, power, and cost-efficiency. This specific model features a -3 speed grade, indicating its relative performance level within the Spartan-6 series.
Key characteristics include its 324-ball, fine-pitch ball grid array (FBGA) package, which provides a compact form factor. The device is equipped with approximately 24,051 logic cells, making it suitable for a wide range of applications, including consumer electronics, automotive, and communication systems.
The XC6SLX25-3CSG324C supports multiple I/O standards and offers integrated DSP slices, block RAM, and clock management features. Its low-power consumption and efficient design make it ideal for applications where heat dissipation and energy efficiency are crucial.
Overall, the XC6SLX25-3CSG324C is a versatile FPGA that provides developers with flexibility and ample resources for implementing complex logic designs in cost-sensitive projects.

Equivalent

The XC6SLX25-3CSG324C is a member of the Xilinx Spartan-6 FPGA family. Equivalent or similar products would include other FPGAs with comparable logic cell count and performance. Alternatives might include:
1. Lattice ECP3-25 series
2. Intel (Altera) Cyclone IV EP4CE22
3. Microsemi (Microchip) IGLOO2 M2GL025
It's important to verify specific requirements like power consumption, I/O count, and package type when considering alternatives.

Features

The XC6SLX25-3CSG324C is a part of Xilinx's Spartan-6 FPGA family, which provides a balance of cost, performance, and power efficiency suitable for a range of applications. Key features include:
1. Logic Resources: Approximately 24,051 logic cells.
2. Memory: 936 Kbits of block RAM.
3. DSP Slices: 38 DSP48A1 slices for signal processing applications.
4. Clock Management: Four Clock Management Tiles (CMTs), each with a Phase-Locked Loop (PLL) and two Digital Clock Managers (DCMs).
5. I/O: 218 user I/Os with support for various I/O standards including LVTTL, LVCMOS, PCI, and more.
6. Communication: Integrated support for various protocols, including PCI Express and Gigabit Ethernet.
7. Configuration: Supports multiple configuration modes like JTAG and SPI.
8. Package: Offered in a 324-ball grid array (BGA) package.
9. Operating Temperature: Commercial grade with a range of 0°C to 85°C.
10. Power: Optimized for low-power applications.
The XC6SLX25-3CSG324C is suitable for applications requiring high performance and flexibility, such as communications, automotive, and consumer electronics.

Pinout

The XC6SLX25-3CSG324C is a member of the Xilinx Spartan-6 family of FPGAs. It comes in a 324-pin Fine-Pitch Ball Grid Array (FBGA) package. The main functions of the XC6SLX25 include providing a programmable logic platform for a variety of applications such as digital signal processing, communication, and advanced interface protocols.
Key features include:
1. Logic Resources: It contains 24,051 logic cells, which consist of configurable logic blocks (CLBs) that enable the creation of complex digital circuits.
2. Memory: The device offers 936 Kbits of Block RAM, which can be used for temporary data storage and buffering.
3. DSP Slices: There are 38 DSP slices available for signal processing applications.
4. I/O Options: The FPGA supports a range of I/O standards and includes dedicated resources for high-speed connectivity.
Overall, the XC6SLX25-3CSG324C is suitable for applications requiring a balance of performance, capacity, and power efficiency.

Manufacturer

The XC6SLX25-3CSG324C is manufactured by Xilinx, Inc. Xilinx is a technology company known for designing and producing programmable logic devices such as FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and ACAPs (Adaptive Compute Acceleration Platforms). These products are widely used in various applications, including telecommunications, data centers, automotive, aerospace, and industrial sectors. Xilinx was a pioneer in the development of FPGAs, providing hardware designers with the flexibility to configure processors to their specific needs, allowing for rapid prototyping and iterative development. The company is known for its innovative solutions that enable efficient and scalable processing power, catering to industries that require high performance and adaptability. Xilinx became a wholly-owned subsidiary of AMD (Advanced Micro Devices, Inc.) in 2022, following an acquisition deal. This merger aimed to broaden AMD's product portfolio and strengthen its position in the semiconductor industry by leveraging Xilinx's expertise in programmable devices and adaptable computing.

Application

The XC6SLX25-3CSG324C is a FPGA from Xilinx's Spartan-6 family, commonly used in various applications due to its flexibility and cost-effectiveness. Key application areas include:
1. Consumer Electronics: Enhancing multimedia processing and connectivity in products like TVs and set-top boxes.
2. Industrial Automation: Enabling efficient control systems and signal processing in manufacturing environments.
3. Communications: Supporting protocols and data processing in networking equipment.
4. Automotive: Used in infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Implementing real-time processing in diagnostic and imaging equipment.
6. Aerospace and Defense: Providing robust solutions for avionics and defense systems.
These applications leverage the FPGA's programmable nature for custom logic implementation and scalability.

Package

The XC6SLX25-3CSG324C is a part of the Xilinx Spartan-6 FPGA family. It comes in a CSG324 package type, which is a Fine-Pitch Ball Grid Array (FBGA) package with 324 balls. This packaging is designed to provide a compact and efficient way to mount the FPGA on PCBs, facilitating high-density and high-performance applications.

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