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XC6SLX25-3CSG324I
+Lista de MateriaisIC FPGA 226 I/O 324CSBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC6SLX25-3CSG324I
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Pacote 324-LFBGA
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1879 |
| NumberofLogicElements/Cells | 24051 |
| TotalRAMBits | 958464 |
| NumberofI/O | 226 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
Visão Geral
Description
With approximately 24,051 logic cells, this FPGA is suitable for a range of applications, including consumer electronics, telecommunications, and industrial automation. It supports various I/O standards and features integrated DSP slices for efficient signal processing tasks. The device is built on a 45 nm process technology, offering a good trade-off between power consumption and computational capabilities. Overall, the XC6SLX25-3CSG324I is a versatile component for developers looking to implement flexible and cost-effective digital designs.
Equivalent
1. Intel (Altera) Cyclone IV series, such as EP4CE22F17C6N.
2. Lattice ECP3 series, such as LFE3-35EA.
3. Microsemi (formerly Actel) IGLOO2 or SmartFusion2 series.
These FPGAs are comparable in terms of logic capacity, I/O options, and applications focusing on low to mid-range FPGA requirements. Always check specific requirements and datasheets for compatibility.
Features
1. Logic Cells: 24,051 logic cells provide sufficient resources for a wide range of applications.
2. Slices: Contains 3,758 slices, each with four 6-input LUTs (Look-Up Tables) and eight flip-flops.
3. DSP Slices: Features 38 DSP slices for efficient digital signal processing tasks.
4. Block RAM: Offers 936 Kbits of block RAM for on-chip data storage.
5. Clock Management: Includes 4 clock management tiles, each with a phase-locked loop for flexible clocking schemes.
6. I/O Pins: Supports 218 user I/O pins for interfacing with external components.
7. Temperature Range: Rated for industrial temperature range (-40°C to +100°C), suitable for demanding environments.
8. Package: Comes in a 324-ball fine-pitch ball grid array (CSG324) package.
9. Configuration: Compatible with various configuration options, including SPI and BPI flash.
These features make the XC6SLX25-3CSG324I suitable for applications such as consumer electronics, automotive, and industrial systems.
Pinout
The primary function of this FPGA is to serve as a programmable logic device used for a variety of applications, such as digital signal processing, embedded systems, and custom digital logic design. The XC6SLX25 variant provides a balance between resource availability and cost, making it suitable for moderate complexity designs.
Key features of the XC6SLX25 include:
- 24,051 logic cells
- 116Kbits of Block RAM
- 38 DSP slices
- Multiple clock management tiles with phase-locked loops (PLLs)
- Support for various I/O standards and protocols
The device is designed for industrial temperature range applications, indicated by the "I" in its part number. It offers flexibility, reconfigurability, and a degree of customization for specific project needs while maintaining energy efficiency and cost-effectiveness.
Manufacturer
Xilinx is known for its innovation in creating products that allow customers to customize hardware functionality to meet specific needs, providing a high degree of flexibility in design. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a leading company in the semiconductor industry known for its CPUs, GPUs, and other computing technologies. This acquisition aimed to enhance AMD's ability to deliver high-performance and adaptive computing solutions.
The XC6SLX25-3CSG324I is part of the Xilinx Spartan-6 FPGA family, which offers a cost-effective solution for a wide range of applications, providing a balance between performance and power consumption.
Application
1. Embedded Systems: Used for custom processing tasks and interfacing with peripherals.
2. Communications: Supports protocols and data processing functions in routers, switches, and wireless systems.
3. Industrial Automation: Enables control and monitoring solutions in manufacturing processes.
4. Consumer Electronics: Powers functions in digital TVs and set-top boxes.
5. Automotive: Used in infotainment systems and advanced driver assistance systems (ADAS).
6. Medical Devices: Supports data acquisition and processing in diagnostics equipment.
These applications benefit from its reconfigurability, low power consumption, and efficient performance.