XC6SLX45-2CSG324I

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XC6SLX45-2CSG324I

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IC FPGA 218 I/O 324CSBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XC6SLX45-2CSG324I

  • Pacote 324-LFBGA,CSPBGA

  • Em Estoque7547

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Especificações

Atributo Valor
Package Tray
Series Spartan®-6 LX
ProductStatus Active
NumberofLABs/CLBs 3411
NumberofLogicElements/Cells 43661
TotalRAMBits 2138112
NumberofI/O 218
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 324-LFBGA, CSPBGA

Visão Geral

Description

The XC6SLX45-2CSG324I is a member of the Xilinx Spartan-6 FPGA family, designed for low-cost, low-power applications. It features 43,661 logic cells, making it suitable for moderate-complexity digital designs. The device is packaged in a 324-pin Fine-Pitch Ball Grid Array (FBGA) and operates with a speed grade of "-2," which indicates moderate performance capabilities. The "I" at the end of the part number signifies industrial-grade temperature range (-40°C to 100°C), making it suitable for harsh environments.
Key features include a rich set of configurable logic blocks (CLBs), abundant RAM blocks, DSP slices for signal processing applications, and multiple I/O standards, enabling versatile interfacing options. The FPGA supports Xilinx's proprietary development tools, such as Vivado or ISE, allowing for efficient design implementation and debugging.
The XC6SLX45 is commonly used in applications like telecommunications, automotive systems, and consumer electronics due to its balance between cost, performance, and power efficiency. It is also favored for educational purposes and prototyping because of its comprehensive feature set and accessibility.

Equivalent

The XC6SLX45-2CSG324I is a Xilinx Spartan-6 FPGA. Equivalent products include Altera's Cyclone IV series and Lattice's ECP3 series, which offer similar functionality and performance in applications such as consumer electronics, automotive, and industrial control. Specific models like Altera's EP4CE45 or Lattice's LFE3-45 may serve as potential alternatives, depending on the specific design requirements and constraints. Compatibility in terms of I/O and power specifications should be verified for each alternative.

Features

The XC6SLX45-2CSG324I is a member of the Xilinx Spartan-6 FPGA family, designed for a broad range of applications. Key features include:
1. Logic Cells: It contains approximately 43,661 logic cells.
2. System Gates: Offers around 221,184 equivalent system gates.
3. Memory: Features 2,088 Kbits of block RAM.
4. DSP Slices: Includes 58 DSP slices for signal processing tasks.
5. I/O Pins: Provides 232 user I/O pins.
6. Performance: Operates with a speed grade of -2, balancing power consumption and performance.
7. Package: Comes in a compact 324-ball grid array (CSG324) package.
8. Temperature Range: Industrial-grade device, supporting temperatures from -40°C to +100°C.
9. Power Management: Includes advanced low-power features.
10. Connectivity: Supports various I/O standards and protocols, enhancing interfacing capabilities.
These features make the XC6SLX45-2CSG324I suitable for applications requiring moderate logic density, efficient power management, and robust performance across challenging environmental conditions.

Pinout

The XC6SLX45-2CSG324I is a member of the Xilinx Spartan-6 FPGA family. It comes in a CSG324 package, which has a pin count of 324.
This FPGA is designed for a wide range of applications that require low power consumption and high performance. The XC6SLX45-2CSG324I includes features such as:
1. Logic Cells: Approximately 43,661 logic cells are available for implementing custom logic.
2. Memory: It includes 2,088 Kbits of block RAM for storing data.
3. DSP Slices: The FPGA has 58 DSP slices for high-speed arithmetic operations.
4. I/O Pins: It supports 218 user I/O pins for interfacing with other devices.
5. Clock Management: It has 4 clock management tiles, each with a phase-locked loop (PLL) for precise clock generation.
6. Temperature Range: It is specified for an industrial temperature range.
The XC6SLX45-2CSG324I is suitable for applications in areas like digital signal processing, embedded systems, and communication systems, where balance between performance, power, and cost is crucial.

Manufacturer

The XC6SLX45-2CSG324I is manufactured by Xilinx, Inc. Xilinx is a technology company primarily known for its development of field-programmable gate arrays (FPGAs), programmable system-on-chips (SoCs), and adaptive compute acceleration platforms (ACAPs). These products are used in a variety of applications, including telecommunications, data centers, automotive, aerospace, and consumer electronics. Xilinx's FPGAs are particularly valued for their flexibility and ability to be configured by customers to perform specific logic functions, making them suitable for a wide range of uses. The company was founded in 1984 and was a pioneer in the FPGA industry. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry, known for its CPUs and GPUs. The acquisition was completed in 2022, further expanding AMD's portfolio into adaptive computing solutions.

Application

The XC6SLX45-2CSG324I is a Xilinx Spartan-6 FPGA that is commonly used in various applications due to its balance of performance, power, and cost. Its primary application areas include:
1. Embedded Systems: Utilized for custom computing tasks and hardware acceleration.
2. Industrial Automation: Employed in control systems and robotics.
3. Communications: Used in data processing for networking equipment.
4. Consumer Electronics: Integrated into devices for processing and interfacing needs.
5. Automotive Systems: Applied in infotainment and advanced driver-assistance systems (ADAS).
6. Medical Devices: Used for processing and control in diagnostic equipment.
These applications benefit from its configurable logic, high-speed interfaces, and low power consumption.

Package

The XC6SLX45-2CSG324I is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-6 family. The package type "CSG324" indicates a Fine-Pitch Ball Grid Array (FBGA) with 324 balls, designed for efficient heat dissipation and compact form factor applications.

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