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XC6SLX75-2FGG484I
+Lista de MateriaisIC FPGA 280 I/O 484FBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC6SLX75-2FGG484I
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Pacote BGA-484
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Em Estoque5994
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 280 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Operating at a speed grade of -2, the XC6SLX75 provides a balance between performance and power efficiency, suitable for moderate-speed applications. The "I" suffix denotes its industrial-grade temperature range, ensuring reliable operation in challenging environments from -40°C to +100°C.
The Spartan-6 series boasts enhanced power management capabilities and integrated memory, including 4,656 Kbits of Block RAM. It supports various I/O standards and features advanced DSP slices for efficient signal processing tasks. The device is ideal for applications in industrial, automotive, and consumer electronics where cost-effectiveness and flexibility are critical. With its robust design and support for a wide range of peripherals, the XC6SLX75-2FGG484I stands out as a reliable solution for developing sophisticated digital systems.
Equivalent
1. Intel/Altera Cyclone IV series, specifically models similar in logic elements and I/O capabilities.
2. Lattice ECP3 series, with comparable logic capacity and performance.
3. Microsemi/Microchip IGLOO2 series, offering similar FPGA features.
Ensure you compare specific parameters like logic cells, I/Os, power consumption, and package compatibility for a precise match.
Features
1. Logic Cells: It contains approximately 74,880 logic cells.
2. Memory: Features 3,096 Kbits of block RAM for efficient data storage.
3. DSP Slices: Includes 132 DSP48A1 slices for high-speed arithmetic operations.
4. I/O Pins: Offers up to 338 user I/O pins, supporting various I/O standards.
5. Clock Management: Contains 6 clock management tiles, each with a phase-locked loop (PLL) for advanced clocking.
6. Configuration: Supports multiple configuration options, including JTAG and serial peripheral interface (SPI).
7. Power: Designed for low power consumption, suitable for power-sensitive applications.
8. Package: Comes in a 484-pin fine-pitch ball grid array (FBGA) package.
9. Temperature Range: Industrial-grade with an operating temperature range of -40°C to +100°C.
This FPGA is ideal for applications in automotive, consumer electronics, and telecommunication systems.
Pinout
Key functions and features include:
1. Logic Cells: It contains approximately 74,880 logic cells, enabling complex digital circuit designs.
2. Memory: Integrated with Block RAM for efficient data storage and retrieval.
3. DSP Slices: Includes dedicated DSP slices for high-speed arithmetic operations.
4. I/O Capabilities: Provides numerous general-purpose I/O pins for interfacing with external components. Supports standards such as LVDS, LVCMOS, and more.
5. Clock Management: Equipped with Digital Clock Managers (DCMs) and Phase Locked Loops (PLLs) for precise clock signal management.
6. Configuration: Supports configuration via JTAG and SPI modes.
These features make the XC6SLX75-2FGG484I suitable for applications in communication, automotive, consumer electronics, and industrial controls.
Manufacturer
Application
1. Consumer Electronics: Used in video and image processing for TVs, set-top boxes, and cameras.
2. Industrial Automation: Supports control systems, motor drives, and data acquisition.
3. Communications: Facilitates signal processing in wireless and wired communications systems.
4. Automotive: Used in infotainment and advanced driver assistance systems (ADAS).
5. Medical Devices: Supports imaging and diagnostic equipment.
6. Security Systems: Used in surveillance and access control systems.
These applications benefit from the device's flexibility, reconfigurability, and efficient performance.