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XC7A100T-1CSG324I
+Lista de MateriaisIC FPGA 210 I/O 324CSBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7A100T-1CSG324I
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Pacote BGA-324
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Em Estoque5680
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Artix-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 7925 |
| NumberofLogicElements/Cells | 101440 |
| TotalRAMBits | 4976640 |
| NumberofI/O | 210 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
Visão Geral
Description
Key features of the XC7A100T-1CSG324I include:
1. Architecture: Based on a high-performance CMOS process, it offers a balance of logic, memory, and DSP resources.
2. Logic Cells: It contains approximately 101,440 logic cells, providing ample processing capability for complex designs.
3. I/O and Interfaces: With up to 210 user I/Os, it supports a wide variety of protocols and interfaces, enabling connectivity and integration with other system components.
4. Package and Speed Grade: The CSG324 indicates a 324-ball Fine-Pitch Ball Grid Array (FBGA) package, while the 1 denotes the speed grade, which impacts the device's performance specifications.
5. Temperature Range: The I in its designation signifies an industrial temperature range, making it suitable for environments requiring operation between -40°C to +100°C.
Overall, the XC7A100T-1CSG324I offers an efficient solution for developers looking to implement advanced digital designs within a compact footprint.
Equivalent
1. Intel Cyclone V series FPGAs.
2. Lattice ECP5 series FPGAs.
3. Microsemi (now part of Microchip) IGLOO2 or SmartFusion2 FPGAs.
These alternatives depend on specific requirements like power, performance, and package size, so it's essential to compare specs for a precise match.
Features
1. Fabric & Logic Resources: It has approximately 101,440 logic cells and 15,850 logic slices. This allows for significant computational and processing capabilities.
2. Block RAM: Provides around 4.9Mb of block RAM, facilitating efficient data management and buffering.
3. DSP Slices: Contains 240 DSP slices, which are crucial for high-performance digital signal processing applications.
4. I/O and Interfaces: Offers up to 210 user I/Os and supports various I/O standards, including LVDS and PCI Express, making it versatile for different applications.
5. Performance: Operates at a maximum clock frequency of around 450 MHz, suitable for high-speed data processing.
6. Power and Temperature: Features a -1 speed grade and is industrially rated, suitable for temperatures ranging from -40°C to 100°C.
7. Package: Comes in a CSG324 package, which is compact and aids in efficient board design.
These features make the XC7A100T well-suited for a wide range of applications, including communications, automotive, and more.
Pinout
The primary functions of the XC7A100T include:
1. Programmable Logic Blocks: Used for implementing custom digital circuits.
2. DSP Slices: Useful for digital signal processing tasks like filtering, data compression, and more.
3. Block RAM: Provides embedded memory for data storage and operations.
4. Clock Management: Includes clock management tiles (CMTs) for clock signal routing and management.
5. I/O Pins: Supports various I/O standards for interfacing with other devices.
6. MicroBlaze Processor Support: Can implement soft processors for embedded processing tasks.
The FPGA is suitable for applications in areas like communication, automotive, industrial, and consumer electronics. Its features are tailored to provide a balance between performance, power consumption, and cost.