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XC7A200T-2FBG676C
+Lista de MateriaisIC FPGA 400 I/O 676FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7A200T-2FBG676C
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Pacote FCBGA-676
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Artix-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 16825 |
| NumberofLogicElements/Cells | 215360 |
| TotalRAMBits | 13455360 |
| NumberofI/O | 400 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 676-BBGA, FCBGA |
Visão Geral
Description
Key features of the XC7A200T-2FBG676C include:
1. Logic Cells and LUTs: It contains approximately 215,360 logic cells and 134,600 lookup tables (LUTs), providing considerable processing capability.
2. I/O and Interfaces: The chip supports multiple I/O standards and offers a range of high-speed connectivity options, suitable for various interface protocols.
3. Clock Management: Equipped with advanced clock management features, including mixed-mode clock managers (MMCMs) and PLLs, for precise timing and control.
4. Memory: The FPGA includes block RAM, which supports high data throughput with integrated error correction capabilities.
5. Package and Power: It comes in a FBG676 package, offering moderate density and is optimized for reduced power usage.
These attributes make the XC7A200T-2FBG676C a versatile choice for developers needing a cost-effective yet robust FPGA solution.
Equivalent
Features
Key features include:
1. Logic Resources: It offers approximately 215K logic cells, making it suitable for complex designs.
2. DSP Slices: Contains 740 DSP slices for efficient signal processing.
3. Memory: Features integrated block RAM with a capacity of around 13,140 Kbits.
4. I/O Pins: Supports 300 user I/Os for extensive connectivity options.
5. Performance: The "-2" speed grade indicates a balanced trade-off between power and performance.
6. Package: Comes in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package.
7. Power Efficiency: Built on a 28nm process technology for reduced power consumption.
8. Applications: Ideal for cost-sensitive applications like wireless communication, data processing, and video processing.
The XC7A200T-2FBG676C combines performance, scalability, and power efficiency, making it a versatile choice for a variety of embedded system applications.
Pinout
Regarding its functions, the XC7A200T offers:
1. Logic Cells: It features 215,360 logic cells for complex digital circuit implementations.
2. DSP Slices: The device includes 740 DSP slices, useful for signal processing tasks.
3. Block RAM: It contains 13,140 Kb of block RAM for data storage.
4. Clock Management: It has clock management tiles (CMTs) for clock signal distribution and management.
5. I/O Pins: The FPGA supports a variety of I/O standards and includes multiple I/O banks for flexibility in interfacing.
6. Transceivers: It features high-speed serial transceivers suitable for applications requiring fast data transfer rates.
These features make the XC7A200T suitable for applications in aerospace, defense, communications, and other industries demanding efficient computation and data processing.
Manufacturer
Application
1. Communications: Used in wireless communication systems, base stations, and high-speed networking equipment.
2. Automotive: Supports advanced driver-assistance systems (ADAS) and infotainment systems.
3. Industrial: Applied in automation systems, motor control, and sensor interfaces.
4. Consumer Electronics: Utilized in high-definition displays and video processing.
5. Medical Devices: Applied in imaging equipment and portable medical devices.
6. Aerospace and Defense: Used in avionics, radar systems, and secure communications.
These applications benefit from its balance of performance, cost, and power efficiency.