XC7A200T-2FFG1156I

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XC7A200T-2FFG1156I

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IC FPGA 500 I/O 1156FCBGA

  • FabricanteAMD Xilinx

  • Peça do Fabricante #XC7A200T-2FFG1156I

  • Pacote BGA-1156

  • Em Estoque5017

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Especificações

Atributo Valor
Package / Case Tray
Series Artix-7
Part Status Active
Number of LABs/CLBs 16825
Number of Logic Elements/Cells 215360
Total RAM Bits 13455360
Number of I/O 500
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Visão Geral

Description

The XC7A200T-2FFG1156I is a member of Xilinx's Artix-7 FPGA family, built on a 28nm process. It features:
- 215,360 logic cells
- 13,140 Kb block RAM
- 740 DSP slices
- 16 transceivers (6.6 Gbps each)
- 200 MHz max clock speed
Packaged in a 1156-pin flip-chip BGA (FFG1156), it supports industrial temperature ranges (-40°C to +100°C).
Key applications include embedded vision, motor control, and wireless communications, offering a balance of performance, power efficiency, and cost. It supports PCIe Gen2, Gigabit Ethernet, and DDR3 memory interfaces.
The -2 speed grade ensures optimized performance for timing-critical designs.
*Note: Requires Vivado Design Suite for development.*

Equivalent

The XC7A200T-2FFG1156I is a Xilinx Artix-7 FPGA. Equivalent alternatives include:
1. Intel (Altera) Cyclone V (e.g., 5CEBA4F23C8N)
2. Lattice ECP5 (e.g., LFE5UM-85F-8BG381C)
3. Microsemi (Microchip) SmartFusion2 (e.g., M2S090-FGG484)
These offer similar logic capacity, performance, and features. For exact replacements, check vendor specs for compatibility.

Features

The Xilinx XC7A200T-2FFG1156I is a mid-range Artix-7 FPGA with these key features:
- Logic Cells: 215,360
- DSP Slices: 740
- Block RAM: 13,140 Kb (750 x 18 Kb)
- Clock Management: 6 MMCMs, 6 PLLs
- I/O Pins: 400 (supports LVDS, LVCMOS, etc.)
- Transceivers: None (Artix-7 lacks high-speed transceivers)
- Process Technology: 28nm
- Package: 1156-pin FCBGA (2FFG1156)
- Speed Grade: -2 (moderate performance)
- Power Efficiency: Optimized for cost-sensitive, low-power apps.
Ideal for embedded, industrial, and consumer applications requiring high logic density and DSP performance.

Pinout

The XC7A200T-2FFG1156I is a Xilinx Artix-7 FPGA with:
- Pin count: 1,156 pins (FFG1156 package).
- Key functions:
- Logic cells: ~215K
- DSP slices: 740
- Block RAM: 13.1 Mb
- I/O pins: 500+ (supports LVDS, LVCMOS, etc.)
- High-speed transceivers: Up to 16 (6.6 Gbps each)
- Clock management: PLLs & MMCMs
It supports PCIe Gen2/3, Gigabit Ethernet, and DDR3 memory, making it suitable for embedded, industrial, and communication applications.

Manufacturer

The XC7A200T-2FFG1156I is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx (AMD) is a leading semiconductor company specializing in adaptive computing solutions, including FPGAs, SoCs, and programmable logic devices. Known for innovation in reconfigurable hardware, its products are widely used in aerospace, automotive, data centers, and telecommunications.
The XC7A200T belongs to the Artix-7 family, offering a balance of performance, power efficiency, and cost for embedded applications. The 2FFG1156I suffix indicates its speed grade, package (FFG1156), and industrial temperature range.

Application

The XC7A200T-2FFG1156I, a Xilinx Artix-7 FPGA, is widely used in:
1. Embedded Systems – Industrial automation, robotics.
2. Communications – Software-defined radio (SDR), networking.
3. Aerospace & Defense – Radar, avionics.
4. Medical Devices – Imaging, diagnostics.
5. Consumer Electronics – High-performance video processing.
6. Automotive – ADAS, infotainment.
Its low power, high logic density (215K logic cells), and 1156-pin BGA package make it ideal for cost-sensitive, high-performance applications.

Package

The XC7A200T-2FFG1156I is a Field-Programmable Gate Array (FPGA) from Xilinx's Artix-7 family. It comes in a 1156-ball Fine-Pitch Ball Grid Array (FBGA) package (FFG1156). The "2" denotes its speed grade, and "I" indicates an industrial temperature range (-40°C to +100°C). This package is compact and suitable for high-performance, low-power applications.

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