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XC7A35T-1FTG256I
+Lista de MateriaisIC FPGA 170 I/O 256FTBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7A35T-1FTG256I
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Pacote FBGA-256
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 2600 |
| Number of Logic Elements/Cells | 33280 |
| Total RAM Bits | 1843200 |
| Number of I/O | 170 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features include:
- Logic Cells: Approximately 33,280, providing substantial capability for implementing complex logic.
- DSP Slices: 90, facilitating efficient signal processing tasks.
- Block RAM: 1,800 Kb of on-chip memory, useful for data storage and buffering.
- I/O Pins: 210 user I/O pins, enabling versatile connectivity.
- Package: FTG256, a fine-pitch BGA package ensuring a compact form factor.
- Temperature Range: Industrial-grade (-40°C to +100°C), suitable for demanding environments.
The XC7A35T-1FTG256I is ideal for applications in telecommunications, automotive, industrial, and consumer electronics, where a balance of performance and power consumption is crucial. Its programmability and scalability make it a versatile choice for designers aiming to implement custom hardware solutions.
Equivalent
1. Intel Cyclone IV E (e.g., EP4CE22F17C6N)
2. Lattice Semiconductor's iCE40 family (e.g., iCE40HX8K)
3. Microchip SmartFusion2 (e.g., M2S050-FGG484)
Consider factors like logic cells, I/O count, and package type when selecting equivalents.
Features
1. Logic Resources: It offers approximately 33,280 logic cells, suitable for moderate complexity designs.
2. DSP Slices: Includes 90 DSP slices for efficient signal processing capabilities.
3. RAM: Provides up to 1,800 Kbits of block RAM for data storage.
4. I/O Pins: Supports up to 210 user I/O pins, facilitating extensive connectivity options.
5. Clock Management: Features advanced clock management with multiple clocking resources.
6. Package: Housed in a FTG256 package, which is a fine-pitch BGA with 256 pins.
7. Temperature Range: The "-1I" designation indicates an industrial temperature range, from -40°C to +100°C.
8. Power: Optimized for low power consumption, ideal for applications like portable or energy-sensitive devices.
9. Applications: Commonly used in industries such as automotive, consumer electronics, and industrial automation due to its balance of performance, power, and cost.
These features make it suitable for various high-performance applications requiring efficient processing and flexibility.
Pinout
The device features a balance of logic resources, block RAM, and DSP slices, allowing for versatile design capabilities. It supports multiple I/O standards, and its low power consumption makes it ideal for cost-sensitive applications requiring efficient performance. The FPGA also offers high-speed serial connectivity options and supports Xilinx's Vivado Design Suite for programming and configuration.