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XC7K160T-1FFG676C
+Lista de MateriaisIC FPGA 400 I/O 676FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7K160T-1FFG676C
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Pacote BGA-676
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 12675 |
| Number of Logic Elements/Cells | 162240 |
| Total RAM Bits | 11980800 |
| Number of I/O | 400 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
Key features of the XC7K160T include approximately 160,000 logic cells, over 400 I/O pins, and a rich set of hard IP cores such as DSP slices, block RAM, and clock management resources. It supports a variety of I/O standards and is suitable for applications ranging from high-speed networking and video processing to wireless communication and data center acceleration.
The package type "FFG676" indicates a Fine-Pitch Ball Grid Array (FBGA) with 676 balls, and the speed grade "-1" denotes the slowest performance tier available for this model. The device is commonly used in industries seeking a balance between high-speed processing capabilities and cost efficiency.
Equivalent
1. Intel (formerly Altera) Cyclone V or Arria V series.
2. Lattice Semiconductor's ECP5 series.
3. Microchip (formerly Microsemi) SmartFusion2 or IGLOO2 FPGAs.
These alternatives provide similar logic elements, DSP slices, and memory resources, but exact equivalency depends on specific application requirements. It's essential to verify compatibility based on system needs and performance criteria.
Features
1. Logic Cells: Approximately 160,000 logic cells enable high-performance processing tasks.
2. DSP Slices: 600 DSP slices for efficient digital signal processing.
3. Block RAM: 11,700 Kb of block RAM to support data storage and processing needs.
4. Transceivers: Capable of data rates up to 12.5 Gbps, supporting high-speed serial interfaces.
5. I/O Pins: Offers a flexible I/O configuration, with up to 400 user I/O pins.
6. Power Efficiency: Built on a 28nm process technology, it provides improved power efficiency for various applications.
7. Form Factor: Packaged in an FFG676 footprint, making it suitable for compact designs.
8. Clock Management: Integrated clock management tiles for precise control and distribution of clock signals.
9. Applications: Ideal for applications in communication, automotive, industrial, and consumer markets due to its balance of performance, power, and cost.
These features make it suitable for a wide range of applications requiring high performance and efficiency.
Pinout
The functions of the pins in this package are diverse and include general-purpose I/O, dedicated configuration pins, power and ground connections, and specialized pins for clocking and memory interfaces. The specific function of each pin can be identified using the pinout diagram provided in the Xilinx datasheet or user guide for the Kintex-7 family. These documents detail the capabilities of the FPGA, including I/O standards supported, dedicated transceiver pins, and the configuration options. For precise design and development, refer to the official documentation provided by Xilinx, which includes detailed descriptions and recommendations for using each pin effectively.
Manufacturer
Xilinx’s FPGAs, like the XC7K160T, are widely used in these industries for their flexibility, allowing designers to configure the hardware according to specific requirements. This adaptability makes them ideal for applications that require rapid prototyping and development of digital circuits.
In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), another leading semiconductor company, further enhancing its capabilities in the design and manufacturing of high-performance processors and graphics solutions. This acquisition aimed to leverage the strengths of both companies to offer more comprehensive and advanced solutions in the rapidly evolving technology landscape.