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XC7K160T-2FFG676I
+Lista de MateriaisIC FPGA 400 I/O 676FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7K160T-2FFG676I
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Pacote FCBGA-676
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Em Estoque7632
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 12675 |
| Number of Logic Elements/Cells | 162240 |
| Total RAM Bits | 11980800 |
| Number of I/O | 400 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
- Logic Capacity: ~160K logic cells, 12,620 slices.
- DSP Slices: 240, optimized for high-performance math operations.
- Memory: 10.2 Mb block RAM, 1,860 Kb distributed RAM.
- I/O: 400 user I/Os supporting multiple standards (LVDS, LVCMOS, etc.).
- Package: 676-pin FineLine BGA (FFG676), suitable for high-speed designs.
- Speed Grade: -2, indicating moderate performance.
- Applications: Used in telecom, embedded vision, and industrial control due to its balance of power, performance, and cost.
It supports PCIe Gen2, Gigabit Ethernet, and high-speed serial transceivers (up to 12.5 Gbps). Ideal for mid-range FPGA applications requiring reliability and flexibility.
Equivalent
1. Intel (Altera) Cyclone 10 GX: Similar mid-range FPGA.
2. Lattice ECP5: Lower-cost alternative for less demanding applications.
3. Microsemi (Microchip) PolarFire: Competitive in power and performance.
4. Xilinx Artix-7 or Zynq-7000: For cost-sensitive or embedded applications.
Check specs for exact compatibility.
Features
- Logic Cells: 162,240
- DSP Slices: 240
- Block RAM: 11,340 Kb
- Transceivers: 8 GTX (6.6 Gbps each)
- I/O Pins: 400 (supports LVDS, LVCMOS, etc.)
- Fabric Speed Grade: -2 (moderate performance)
- Package: 676-pin FineLine BGA (FFG676)
- Operating Temp: Industrial (-40°C to +100°C)
- Power Efficiency: 28nm process, optimized for cost-sensitive applications.
Ideal for high-speed data processing, embedded systems, and telecom.
Pinout
- Pin Count: 676 pins (FFG676 package, Fine-pitch Ball Grid Array).
- Functions:
- Logic: 162,240 logic cells, 12,700 slices.
- DSP: 480 DSP slices.
- Memory: 12.8 Mb block RAM.
- I/O: 400+ user I/Os (supports LVDS, LVCMOS, etc.).
- Transceivers: Up to 16 GTX transceivers (6.6 Gbps each).
- Clock Management: 10 mixed-mode clock managers (MMCMs) & PLLs.
It supports high-speed interfaces (PCIe, Ethernet) and is used in applications like embedded processing, wireless, and video.
Manufacturer
Xilinx (AMD) is a leading semiconductor company specializing in programmable logic devices (FPGAs, SoCs) and adaptive computing solutions. Known for innovation in high-performance computing, AI, and embedded systems, Xilinx products are widely used in aerospace, automotive, data centers, and telecommunications.
The Kintex-7 series balances performance, power efficiency, and cost, making it ideal for mid-range applications. The XC7K160T model features high-speed transceivers, DSP slices, and configurable logic blocks.
Key Points:
- Manufacturer: Xilinx (AMD)
- Device Type: FPGA (Kintex-7 family)
- Applications: Signal processing, networking, embedded systems.
Xilinx remains a dominant force in programmable logic under AMD’s expanded semiconductor portfolio.
Application
- High-speed communications (5G, radar, optical networking)
- Aerospace & defense (avionics, secure systems)
- Industrial automation (motor control, robotics)
- Medical imaging (ultrasound, MRI processing)
- Data centers (accelerators, networking)
- Scientific research (high-energy physics, AI/ML acceleration)
Its high logic density, DSP slices, and 676-pin BGA package make it ideal for complex, high-performance applications requiring real-time processing and low latency.