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XC7K160T-3FFG676E
+Lista de MateriaisIC FPGA 400 I/O 676FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7K160T-3FFG676E
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Pacote BGA-676
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Em Estoque2530
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 12675 |
| Number of Logic Elements/Cells | 162240 |
| Total RAM Bits | 11980800 |
| Number of I/O | 400 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Visão Geral
Description
The "-3" in the part number signifies its speed grade, with higher numbers typically indicating faster performance. The "FFG676" refers to its package type, a fine-pitch ball grid array with 676 pins, providing ample I/O for complex designs. The "E" denotes that it is designed for industrial temperature ranges, ensuring reliability in demanding environments.
Kintex-7 FPGAs like the XC7K160T-3FFG676E are known for their advanced features, including high-speed transceivers, DSP slices, and abundant block RAM, making them ideal for implementing complex algorithms and high-speed data processing tasks efficiently.
Equivalent
Features
1. Logic Cells: Approximately 160,000 logic cells.
2. System Gates: Provides around 1.6 million system gates.
3. Memory: Includes 11,700 Kb of block RAM.
4. DSP Slices: Equipped with 600 DSP slices for high-performance digital signal processing.
5. I/Os: Offers up to 400 user I/Os for extensive connectivity options.
6. Transceivers: Capable of supporting up to 12.5 Gbps transceivers, aimed at high-speed serial communication.
7. Configuration: Uses advanced 28 nm process technology for improved efficiency.
8. Form Factor: Comes in a FFG676 package, which has 676 pins.
9. Power Efficiency: Balances performance with power efficiency, suitable for a wide range of applications.
The XC7K160T-3FFG676E is ideal for applications demanding high performance and flexibility, including communications, automotive, and video/imaging systems.
Pinout
Key functions and features of the XC7K160T-3FFG676E include:
1. Logic Cells: Approximately 160,000 logic cells for implementing complex digital circuits.
2. DSP Slices: Dedicated DSP (Digital Signal Processing) slices for high-speed arithmetic operations.
3. Block RAM: Configurable block RAM for data storage.
4. Connectivity: Supports various I/O standards and high-speed serial connectivity.
5. Clock Management: Integrated clock management tiles for precise clocking operations.
This FPGA is suitable for a wide range of applications including signal processing, communications, and other high-performance computing tasks.