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XC7K325T-3FFG676E
+Lista de MateriaisIC FPGA 400 I/O 676FCBGA
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FabricanteAMD
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Peça do Fabricante #XC7K325T-3FFG676E
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Especificações
| Atributo | Valor |
| Series | Kintex®-7 |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 326080 |
| Total RAM Bits | 16404480 |
| Number of I/O | 400 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XC7K325 |
| Number of LA Bs / CL Bs | 25475 |
Visão Geral
Description
Key features include:
- Logic Cells: The XC7K325T offers 325,000 logic cells, providing ample capacity for complex designs.
- Transceivers: It includes high-speed serial transceivers, supporting data rates up to 6.6 Gbps.
- Memory: The device features up to 20 Mb of block RAM and multiple DSP slices for efficient computational tasks.
- Power Efficiency: Designed for low power consumption, making it suitable for battery-operated and heat-sensitive applications.
- Flexibility: Users can reprogram the FPGA for different applications, ensuring longevity and adaptability.
The package type is FFG676, which is a fine-pitch ball grid array (BGA) format, suitable for compact designs. Overall, the XC7K325T-3FFG676E is a versatile solution for engineers looking to implement flexible and high-performance digital systems.
Equivalent
Features
It has 676 pins in a Fine Pitch Ball Grid Array (FBGA) package, providing a compact solution for various applications. The FPGA incorporates advanced power management with a maximum power consumption of approximately 6.5 watts, making it suitable for power-sensitive designs. Its architecture supports high-speed serial transceivers with data rates up to 12.5 Gbps, facilitating high-bandwidth communication.
Ideal for applications in telecommunications, aerospace, and automotive, the XC7K325T offers versatile and scalable performance for custom digital logic and embedded processing solutions.
Pinout
The functions of the pins include general-purpose I/O, power supply pins, ground pins, configuration pins, and dedicated clock input pins. The FPGA can be programmed to perform complex computations, data processing, and interfacing with various peripherals, making it suitable for applications in communications, automotive, industrial, and consumer electronics.
Overall, the XC7K325T-3FFG676E is designed to balance performance with flexibility for diverse use cases.
Manufacturer
Xilinx's FPGAs, like the XC7K325T-3FFG676E, are widely used in various applications such as telecommunications, automotive, industrial, and consumer electronics, providing flexibility and high performance for custom hardware solutions. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor industry. The company is recognized for its focus on enabling engineers to design and implement complex digital systems efficiently, making it a significant player in the tech landscape.
Application
1. Digital Signal Processing: Used in high-performance signal processing systems.
2. Embedded Systems: Supports real-time processing in embedded applications.
3. Communications: Enables advanced networking and telecom solutions.
4. Image Processing: Facilitates high-speed image and video processing.
5. Automotive: Applied in automotive control systems and advanced driver-assistance systems (ADAS).
6. Industrial Automation: Enhances control systems in manufacturing and robotics.
7. Aerospace and Defense: Used in radar, sonar, and secure communications systems.