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IC FPGA 500 I/O 900FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7K410T-1FFG900C
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Pacote BGA-900
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Em Estoque2572
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 31775 |
| Number of Logic Elements/Cells | 406720 |
| Total RAM Bits | 29306880 |
| Number of I/O | 500 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
Key features include:
1. Logic Cells: It has around 407,600 logic cells, providing significant computational power for complex designs.
2. I/O Pins: The FPGA supports numerous I/O pins, which are vital for interfacing with various system components and peripherals.
3. DSP Slices: With dedicated DSP slices, it is optimized for high-performance digital signal processing applications.
4. Power Efficiency: Built on a 28nm process technology, it offers substantial power savings, which is crucial for energy-sensitive applications.
5. Package: The -1FFG900C denotes the specific package and speed grade, with 'FFG900' indicating the package type and pin count, and '-1' denoting the speed grade.
Overall, the XC7K410T-1FFG900C is a versatile FPGA that addresses performance needs while maintaining lower power usage.
Equivalent
1. Intel (Altera) Arria V series FPGAs, which offer similar mid-range performance.
2. Lattice ECP5 series, although typically lower in logic gates, they provide a cost-effective alternative.
3. Microsemi (Microchip) SmartFusion2 series, which combines FPGA with ARM Cortex-M3 processors, offering an integrated solution for certain applications.
When selecting an equivalent, consider your specific requirements for logic density, power, and features.
Features
1. Logic Cells: Approximately 407,600.
2. DSP Slices: 1,540, suitable for signal processing tasks.
3. Block RAM: About 28,620 Kb, providing ample on-chip storage.
4. I/O Pins: Offers up to 500 I/O pins for versatile interfacing.
5. Transceivers: 16 high-speed GTX transceivers with data rates up to 12.5 Gb/s.
6. Clock Management: Includes up to 10 clock management tiles (CMTs), each with a phase-locked loop (PLL).
7. Package: FFG900, a 900-pin Ball Grid Array (BGA) package.
8. Power: Optimized for low power consumption, leveraging 28 nm process technology.
These features make the XC7K410T-1FFG900C suitable for applications requiring high performance and logic density, such as communications, automotive, and data center solutions.
Pinout
Manufacturer
Application
1. Telecommunications: For signal processing, network infrastructure, and baseband processing.
2. Data Centers: To accelerate data processing tasks, enhance storage systems, and improve network bandwidth.
3. Broadcast and Pro AV: In video processing, encoding, and high-bandwidth video transmission.
4. Aerospace and Defense: For radar, electronic warfare, and secure communication systems.
5. Industrial Automation: In control systems, robotics, and real-time data processing.
6. Medical Imaging: To enhance processing power for imaging equipment like MRI and CT scanners.