Imagens apenas para referência
XC7K410T-2FFG900C
+Lista de MateriaisIC FPGA 500 I/O 900FCBGA
-
FabricanteAMD Xilinx
-
Peça do Fabricante #XC7K410T-2FFG900C
-
Pacote FBGA-900
-
Em Estoque4362
365 Garantia de Qualidade em 1 dia
7*24 Garantia de serviço em 24 horas
90-Garantia de pós-venda em 1 dia
Garantia de Produto Genuíno
Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 31775 |
| Number of Logic Elements/Cells | 406720 |
| Total RAM Bits | 29306880 |
| Number of I/O | 500 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
The "-2" indicates the speed grade, with this model being a mid-range option, balancing performance and power consumption. The "FFG900" denotes the package type and pin count, with FFG indicating a Fine-pitch Ball Grid Array (FBGA) and 900 being the number of pins. The "C" at the end specifies the temperature range, with C indicating commercial use.
Key features include high-speed serial connectivity, efficient digital signal processing (DSP) slices, and advanced memory configurations. The XC7K410T-2FFG900C is ideal for applications like wireless communications, video processing, and other data-intensive tasks. It benefits from Xilinx's Vivado Design Suite for development, offering advanced tools for optimizing and implementing complex designs.
Equivalent
Features
1. Logic Cells: Approximately 406,720.
2. Configurable Logic Blocks (CLBs): Comprised of over 254,200 CLB slices.
3. DSP Slices: Contains 1,540 DSP48E1 slices for high-performance signal processing tasks.
4. Block RAM: Includes 28,620 Kb of block RAM for data storage and processing.
5. Transceivers: Offers 16 GTX transceivers, supporting data rates up to 12.5 Gbps.
6. I/O Pins: Features 500 I/O pins for connectivity.
7. Power Efficiency: Designed with a 28nm process technology for improved power efficiency.
8. Package: Available in an FFG900 package.
9. Clock Management: Includes multiple clock management tiles for robust clocking options.
The XC7K410T-2FFG900C is ideal for applications like wireless communication, aerospace and defense, and broadcast, where performance and efficiency are critical.
Pinout
Key functions and features of the XC7K410T-2FFG900C include:
- Logic Cells: It consists of approximately 406,720 logic cells, providing substantial resources for complex designs.
- DSP Slices: The device includes 1,540 DSP slices, enabling efficient implementation of high-performance digital signal processing operations.
- Block RAM: It offers around 28,620 Kbits of block RAM for on-chip data storage and processing.
- I/O Pins: The exact number of I/O pins can vary depending on configuration and usage, but the package supports extensive general-purpose and high-speed I/O capabilities.
- Transceivers: It features high-speed serial transceivers suitable for applications requiring robust data transmission.
This FPGA is suitable for a wide range of applications, including communications, automotive, and industrial systems, due to its balanced mix of performance, power efficiency, and cost-effectiveness.
Manufacturer
Xilinx is recognized for its innovation in the semiconductor industry, providing highly flexible and adaptable solutions that allow for the customization and optimization of electronic systems. The company's products are integral in enabling hardware acceleration and enhancing the performance of complex processing tasks. Xilinx’s FPGAs, like the XC7K410T-2FFG900C, are particularly valued for their ability to be reconfigured after manufacturing, offering designers and engineers the opportunity to update and optimize their systems as needed.
Xilinx was acquired by AMD (Advanced Micro Devices, Inc.) in 2022, further expanding AMD's footprint in the semiconductor industry and enhancing its capabilities in adaptive computing.