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XC7K70T-1FBG484I
+Lista de MateriaisIC FPGA 285 I/O 484FCBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7K70T-1FBG484I
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Pacote FCBGA-484
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 5125 |
| Number of Logic Elements/Cells | 65600 |
| Total RAM Bits | 4976640 |
| Number of I/O | 285 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
The "-1" speed grade indicates its performance level, while the "I" at the end signifies that it is rated for industrial temperature ranges, typically -40°C to 100°C. This makes it suitable for environments with extreme temperature variations. The Kintex-7 series, including the XC7K70T, offers advanced features like high-speed connectivity, low power consumption, and support for numerous I/O standards.
Overall, the XC7K70T-1FBG484I is a versatile FPGA choice for designers seeking to implement high-performance, energy-efficient solutions across various industries.
Equivalent
Features
1. Logic Cells: Approximately 65,600 logic cells for high-performance computing tasks.
2. DSP Slices: 240 DSP slices for efficient digital signal processing.
3. Block RAM: Around 4,860 Kbits of block RAM to support memory-intensive applications.
4. Connectivity: Numerous I/O pins with support for multiple signaling standards, including LVDS and PCI Express.
5. Clock Management: Multiple clock management tiles (CMTs), each with a mixed-mode clock manager (MMCM) and phase-locked loop (PLL).
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Temperature Range: Industrial temperature range, ensuring reliable operation in harsh environments.
8. Package: Comes in a FBG484 package.
These features make the XC7K70T suitable for applications such as wireless communication, video processing, and data center acceleration.
Pinout
Key functions and features of this FPGA include:
1. Logic Cells: It contains approximately 65,600 logic cells.
2. DSP Slices: The device offers several DSP slices for high-performance signal processing tasks.
3. Block RAM: Includes a substantial amount of block RAM for data storage and buffering.
4. I/O Pins: Offers numerous I/O pins configurable for various standards, making it versatile for different interfacing needs.
5. Clock Management: Equipped with clock management tiles for handling complex clocking requirements.
6. Transceivers: Provides high-speed serial transceivers for fast data transmission.
These features make it suitable for applications requiring high performance and resource efficiency, such as digital signal processing, embedded systems, and advanced communication protocols.
Manufacturer
Application
1. Signal Processing: Used in applications like radar, sonar, and wireless communication for real-time processing.
2. Data Centers: Enhances data throughput and processing in networking and storage applications.
3. Broadcast and Video: Supports video processing and encoding/decoding applications efficiently.
4. Automotive: Used in advanced driver-assistance systems (ADAS) and infotainment.
5. Test and Measurement: Facilitates high-speed data acquisition and analysis.
Its versatility, combined with low power usage, makes it suitable for various high-performance computing tasks across industries.