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XC7S100-2FGGA676I
+Lista de MateriaisIC FPGA 400 I/O 676FPBGA
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FabricanteAMD Xilinx
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Peça do Fabricante #XC7S100-2FGGA676I
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Pacote FBGA-676
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Spartan®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 8000 |
| Number of Logic Elements/Cells | 102400 |
| Total RAM Bits | 4423680 |
| Number of I/O | 400 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
Key features include integrated digital signal processing (DSP) slices, block RAM, and high-speed connectivity options. The device supports multiple I/O standards, which enhances its flexibility for interfacing with various peripherals. It also includes advanced power management features to optimize energy consumption.
The "I" in its part number indicates that it is rated for industrial temperature ranges, ensuring reliable operation in more demanding environmental conditions. The XC7S100-2FGGA676I is supported by Xilinx's Vivado Design Suite, providing a comprehensive set of tools for efficient design, simulation, and implementation. Overall, this FPGA is targeted at applications requiring moderate logic density, low power consumption, and robust performance.
Equivalent
Features
1. Logic Cells: Contains approximately 102,400 logic cells.
2. I/O Pins: Offers up to 400 user I/O pins.
3. Package: Available in a 676-ball grid array (BGA) package.
4. Speed Grade: The '-2' speed grade indicates mid-range performance.
5. Temperature Range: Designed for industrial temperature ranges, hence the 'I' in the part number.
6. Block RAM: Provides about 4,860 Kb of block RAM for data storage.
7. DSP Slices: Includes 240 DSP slices for efficient signal processing tasks.
8. Power: Optimized for low static power consumption to enhance energy efficiency.
9. Configuration: Supports flexible configuration options including JTAG and serial modes.
This FPGA is suitable for applications in automotive, industrial automation, consumer electronics, and more, offering a cost-effective solution with reliable performance.
Pinout
The FPGA provides a balance of logic, memory, and DSP resources, including 101,440 logic cells, 6,800 Kbits of block RAM, and 240 DSP slices. It supports up to 400 MHz of clock frequency, ensuring high-speed operation for complex applications. The device is also designed for low power consumption and offers enhanced I/O capabilities, supporting a wide range of I/O standards. With its temperature range of -40°C to 100°C, the XC7S100-2FGGA676I is suitable for industrial applications requiring reliable performance in variable environmental conditions.
Manufacturer
Application
1. Industrial Automation: Used in control systems and robotics for efficient processing.
2. Consumer Electronics: Supports high-speed data transfer and connectivity in devices.
3. Automotive: Provides robust processing for infotainment and advanced driver-assistance systems (ADAS).
4. Medical Devices: Facilitates processing for imaging and diagnostic equipment.
5. Communication Systems: Enhances data processing in networking and telecommunications.
6. Aerospace and Defense: Offers reliability and performance for avionics and secure communication.
These applications leverage the FPGA's flexibility, performance, and I/O capabilities.